Curable Composition

ABSTRACT

[PROBLEMS] There is provided a curable composition having good curability and adhesiveness.
 
[MEANS FOR SOLVING] A curable composition by comprising
 
     (A) an reactive silicon group-containing organic polymer, 
     (B) a titanium chelate represented by the general formula (1) or (2), 
     (C) a high molecular weight plasticizer having a number average molecular weight of 1000 to 15000: 
     General Formula (1): 
     
       
         
         
             
             
         
       
         
         wherein each of n R 1 &#39;s is independently a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, each of (4-n) R 2 &#39;s is independently hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, each of (4-n) A 1 &#39;s and (4-n) A 2 &#39;s is independently —R 3  or —OR 3  where R 3  is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, n is 1, 2, or 3. 
       
    
     General Formula 
     
       
         
         
             
             
         
       
         
         wherein R 2 , A 1  and A 2  are the same as defined above, R 4  is a substituted or unsubstituted divalent hydrocarbon group havimg 1 to 20 carbon atoms.

TECHNICAL FIELD

The present invention relates to a curable composition comprising an organic polymer containing a silicon-containing group (hereinafter referred to as a “reactive silicon group”) which has hydroxyl group or a hydrolyzable group bonded to the silicon atom and which is capable of crosslinking by forming siloxane bonds.

BACKGROUND ART

It is known that an organic polymer having at least one reactive silicon group in the molecule undergoes crosslinking by formation of siloxane bonds accompanying a hydrolysis reaction of the reactive silicon group with moisture or the like even at room temperature, and a rubber-like cured article can be obtained.

Among the polymers having a reactive silicon group, organic polymers in which the main chain skeleton is a polyoxyalkylene polymer or an isobutylene polymer are disclosed in (Patent Document 1), (Patent Document 2) and the like. Those polymers have already been industrially produced, and are widely used in applications to sealants, adhesives, coatings and the like.

Curable compositions comprising the above described organic polymers having a reactive silicon group are cured by using silanol condensation catalysts, and usually organotin catalysts having a carbon-tin bond such as dibutyltin bis(acetylacetonate) are widely used. However, in recent years, toxicity of organotin compounds is pointed out, and development of non-organotin catalysts are demanded.

With respect to curable silicone compositions prepared using a titanium compound as a non-organotin catalyst, so far many investigations have been made, and are disclosed in (Patent Document 3) and the like. At an initial stage of the investigations, when a titanium compound was used as a curing catalyst, there were many problems with curability, storage stability, an extreme increase in viscosity when silicone came into contact with a titanium catalyst, and the like. As described in (Patent Document 4), (Patent Document 5), (Patent Document 6), (Patent Document 7) and the like, as a result of various investigations made, improvement methods such as modification of a silicone-terminated structure, use of a chelate type titanium compound, and the like have been found, and at the present time, dealcoholization type silicone compositions using titanium catalysts are widely used in a variety of applications.

However there are relatively few examples of adding a titanium catalyst to a reactive silicon group-containing organic polymers. Those examples are disclosed in (Patent Document 8), (Patent Document 9), (Patent Document 10), (Patent Document 11), (Patent Document 12), (Patent Document 13), (Patent Document 14), (Patent Document 15), (Patent Document 16) and (Patent Document 17).

On the other hand, various properties such as curability, adhesion and mechanical properties are demanded for curable compositions used for a sealant, an adhesive, a coating and the like and rubber-like cured articles obtained by curing the compositions. Also with respect to organic polymers having a reactive silicon group, so far many investigations have been made.

As a result, now it is already known that by adding a plasticizer such as phthalic acid ester or the like to a curable composition, suitable mechanical properties such as a modulus, an elongation at break and a strength at break can be obtained in the respective applications. Additionally, (Patent Document 18), (Patent Document 19), (Patent Document 20), (Patent Document 21) and the like disclose techniques for solving, by using a high molecular weight plasticizer as a plasticizer, problems with bleeding out of a plasticizer, slump property, coating property of an alkyd coating material, storage stability and the like which arise when using a low molecular weight plasticizer.

Patent Document 1: JP-52-73998A Patent Document 2: JP-63-6041A

Patent Document 3: JP-39-27643B (U.S. Pat. No. 3,175,993) Patent Document 4: U.S. Pat. No. 3,334,067

Patent Document 5: JP-56-14701B Patent Document 6: JP-55-43119A Patent Document 7: JP-2-133490A Patent Document 8: JP-58-17154A Patent Document 9: JP-11-209538A Patent Document 10: JP-5-311063A Patent Document 11: JP-2001-302929A Patent Document 12: JP-2001-302930A Patent Document 13: JP-2001-302931A Patent Document 14: JP-2001-302934A Patent Document 15: JP-2001-348528A Patent Document 16: JP-2002-249672A Patent Document 17: JP-2003-165916A Patent Document 18: JP-60-8024B Patent Document 19: JP-63-108058A Patent Document 20: JP-1-279958A Patent Document 21: JP-9-176481A DISCLOSURE OF INVENTION Problem to be Solved by the Invention

However as a result of the investigation by the present inventors, it was found that in a curable composition comprising, as a main component, an organic polymer having a reactive silicon group, when using a titanium chelate as a curing catalyst, if a phthalic acid ester plasticizer is used as a plasticizer, in some cases, sufficient general-purpose adhesion cannot be obtained.

It is an object of the present invention to provide a curable composition comprising a reactive silicon group-containing organic polymer as a main component and having practical curability and good adhesion by use of a non-tin curing catalyst.

Means to Solve the Problem

As a result of a diligent investigation to solve such problems, the present inventors perfected the present invention by discovering that a curable composition having practical curability and good adhesion can be obtained by use of a titanium chelate (B) as a curing catalyst for the polymer and further by use of a high molecular weight plasticizer (C) although the catalyst concerned is a non-tin curing catalyst.

Namely, the present invention relates to a curable composition characterized by comprising, as components, (A) an organic polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds, (B) a titanium chelate represented by the following general formula (1) or (2), and (C) a high molecular weight plasticizer having a number average molecular weight of 1,000 to 15,000.

General formula (1):

wherein each of n R¹s is independently a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, each of (4-n) R²s is independently hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, each of (4-n) A¹s and (4-n) A²s is independently —R³ or —OR³ where R³ is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, n is 1, 2 or 3. General formula (2):

wherein R², A¹ and A² are the same as defined above, R⁴ is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms.

A main chain skeleton of the organic polymer of the component (A) is preferably at least one polymer selected from the group consisting of polyoxyalkylene polymers, saturated hydrocarbon polymers and (meth)acrylate polymers. More preferable polyoxyalkylene polymer is a polyoxypropylene polymer.

As the component (C), a high molecular weight plasticizer having a polyoxyalkylene structure in its main chain is preferable, and a high molecular weight polyoxyalkylene plasticizer having no hydroxyl group is particularly preferable.

Additionally, it is preferable that the curable composition of the present invention further contains a silane coupling agent as the component (D).

Additionally, preferred embodiments of the curable composition of the present invention are sealants or adhesives comprising any of the above described curable compositions.

EFFECT OF THE INVENTION

The curable composition of the present invention is excellent in curability and adhesion by use of a non-organotin catalyst.

BEST MODE FOR CARRYING OUT THE INVENTION

The present invention is then explained below in detail.

No particular constraint is imposed on the main chain skeleton of the reactive silicon group-containing organic polymer to be used in the present invention, and polymers having various types of main chain skeletons can be used.

More specifically, examples of the organic polymer include polyoxyalkylene polymers such as polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxytetramethylene, polyoxyethylene-polyoxypropylene copolymer, and polyoxyprolylene-polyoxybutylene copolymer; hydrocarbon polymers such as ethylene-propylene copolymer, polyisobutylene, copolymers of isobutylene and isoprene or the like, polychloroprene, polyisoprene, copolymers of isoprene or butadiene and acrylonitrile and/or styrene and the like, polybutadiene, copolymers of isoprene or butadiene and acrylonitrile, styrene and the like, hydrogenated polyolefin polymers obtained by hydrogenation of these polyolefin polymers; polyester polymers obtained by the condensation of dibasic acids such as adipic acid and glycol, or by the ring-opening polymerization of lactones; (meth)acrylate polymers obtained by radical polymerization of the monomers such as ethyl(meth)acrylate and butyl(meth)acrylate; vinyl polymers obtained by radical polymerization of (meth)acrylate monomers, vinyl acetate, acrylonitrile or styrene; graft polymers obtained by polymerization of vinyl monomers in the above described organic polymers; polysulfide polymers; polyamide polymers such as nylon 6 obtained by ring-opening polymerization of ε-caprolactam, nylon 6,6 obtained by condensation polymerization of hexamethylenediamine and adipic acid, nylon 6,10 obtained by condensation polymerization of hexamethylenediamine and sebacic acid, nylon 11 obtained by condensation polymerization of ε-aminoundecanoic acid, nylon 12 obtained by ring-opening polymerization of ε-aminolaurolactam, and copolymerized nylons containing two or more components of the above described nylons; polycarbonate polymers prepared by condensation polymerization of, for example, bisphenol A and carbonyl chloride; and diallyl phthalate polymers. Moreover, saturated hydrocarbon polymers such as polyisobutylene, hydrogenated polyisoprene, and hydrogenated polybutadiene, polyoxyalkylene polymers and (meth)acrylate polymers are more preferable because these polymers are relatively low in glass transition temperature and yield cured articles excellent in low-temperature resistance.

Also polyoxyalkylene polymers and (meth)acrylate polymers are particularly preferable because adhesion is excellent, and polyoxyalkylene polymers are most preferable.

No particular constraint is imposed on the glass transition temperature of the organic polymer of the component (A). The glass transition temperature is preferably not more than 20° C., more preferably not more than 0° C., particularly preferably not more than −20° C. If the glass transition temperature is higher than 20° C., in some cases, a viscosity increases and workability is lowered in wintertime or at a cold district or flexibility and elongation of the cured article are degraded. The above described glass transition temperature denotes values measured by DSC.

With respect to the titanium chelate (B) of the present invention, depending on the added amounts thereof, in some cases, the deep-part curability of the obtained composition tends to be degraded. Accordingly, polyoxyalkylene polymers and (meth)acrylate polymers are especially preferable because those polymers are excellent in moisture permeability and are excellent in deep-part curability in the case of one-component type composition, and polyoxyalkylene polymers are most preferable.

The reactive silicon group contained in the organic polymer is a group which has a hydroxyl group or a hydrolyzable group bonded to a silicon atom, and is capable of cross-linking through a reaction accelerated by a curing catalyst. Examples of the reactive silicon groups include groups represented by the general formula (3):

—(SiR⁵ _(2-b)X_(b)O)_(m)—SiR⁶ _(3-a)X_(a)  (3)

wherein each of R⁵ and R⁶ independently represents any of an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms or a triorganosiloxy group represented by (R′)₃SiO—, and when two or more of R⁵ or R⁶ are present, they may be the same or different, where R′ is a hydrocarbon group having 1 to 20 carbon atoms, and three R's may be the same or different, X represents hydroxyl group or a hydrolyzable group, and when two or more Xs are present, they may be the same or different, a represents 0, 1, 2 or 3, b represents 0, 1 or 2, in m (SiR⁵ _(2-b)X_(b)O) groups, b may be the same or different, m represents an integer of 0 to 19, a+Σb≧1 is to be satisfied.

No particular constraint is imposed on the hydrolyzable group, and the hydrolyzable group may be a hydrolyzable group well known in the art. More specifically, examples of the hydrolyzable group include, for instance, hydrogen atom, a halogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an acid amide group, an aminooxy group, a mercapto group, an alkenyloxy group and the like. Among these groups, hydrogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an aminooxy group, a mercapto group and an alkenyloxy group are preferable and an alkoxy group is particularly preferable from the viewpoint that an alkoxy group is moderately hydrolyzable and easily handled.

One to three hydrolyzable groups and hydroxyl groups can bond to one silicon atom, and (a+Σb) is preferably within a range from 1 to 5. When two or more hydrolyzable groups and hydroxyl groups are bonded in the reactive silicon group, they may be the same or different.

The number of silicon atoms forming the reactive silicon group is one or more, and is preferably not more than 20 in the case of the silicon atoms connected by siloxane bonds.

Particularly reactive silicon groups represented by the general formula (4):

—SiR⁶ _(3-c)X_(c)  (4)

wherein R⁶ and X are the same as defined above, c is an integer of 1 to 3, are preferable because they are easily available.

Examples of R⁵ and R⁶ in the above described general formulae (3) and (4) include alkyl groups such as a methyl group and an ethyl group, cycloalkyl groups such as a cyclohexyl group, aryl groups such as a phenyl group, aralkyl groups such as a benzyl group, a triorganosiloxy group represented by (R′)₃SiO— where R′ is a methyl group, a phenyl group or the like and the like group. Of these groups, a methyl group is particularly preferable.

More specific examples of the reactive silicon group include a trimethoxysilyl group, a triethoxysilyl group, a triisopropoxysilyl group, a dimethoxymethylsilyl group, a diethoxymethylsilyl group and a diisopropoxymethylsilyl group. A trimethoxysilyl group, a triethoxysilyl group and a dimethoxymethylsilyl group are more preferable and a trimethoxysilyl group is particularly preferable because these groups are high in activity and satisfactory curability can be obtained. Also from the viewpoint of storage stability, a dimethoxymethylsilyl group is particularly preferable. Additionally, a triethoxysilyl group and a diethoxymethylsilyl group are particularly preferable because the alcohol produced by the hydrolysis reaction of the reactive silicon group is ethanol and hence a triethoxysilyl group and a diethoxymethylsilyl group have a high safety.

The introduction of the reactive silicon group can be carried out by methods well known in the art. More specifically, examples of such methods include the followings.

(a) With an organic polymer having in the molecule functional groups such as hydroxy groups, an organic compound having both an active group exhibiting reactivity to the functional groups and an unsaturated group is reacted, to yield an unsaturated group-containing organic polymer. Alternatively, an unsaturated group-containing organic polymer is obtained by copolymerization of an epoxy compound having an unsaturated group with an organic polymer having in the molecule functional groups such as hydroxy groups. Then, a reactive silicon group-containing hydrosilane is reacted with the reaction product to be hydrosilylated.

(b) With an unsaturated group-containing organic polymer obtained similarly to the method described in (a), a mercapto group- and reactive silicon group-containing compound is reacted.

(c) With an organic polymer having in the molecule functional groups such as hydroxy groups, epoxy groups and isocyanate groups, a compound having a functional group exhibiting reactivity to the functional groups and a reactive silicon group is reacted.

Among the above methods, the method described in (a) or the method described in (c) in which a hydroxy group-terminated polymer is reacted with an isocyanate group- and reactive silicon group-containing compound is preferable because the method provides a high conversion rate at a relatively short reaction time. Additionally, the method described in (a) is particularly preferable because the organic polymer obtained by the method described in (a) is lower in viscosity and more satisfactory in workability than an organic polymer obtained by the method described in (c), and an organic polymer obtained by the method described in (b) is strong in odor due to mercaptosilane.

Examples of the hydrosilane compound used in the method described in (a) include halogenated silanes such as trichlorosilane, methyldichlorosilane, dimethylchlorosilane and phenyldichlorosilane; alkoxysilanes such as trimethoxysilane, triethoxysilane, methyldiethoxysilane, methyldimethoxysilane and phenyldimethoxysilane; acyloxysilanes such as methyldiacetoxysilane and phenyldiacetoxysilane; ketoximate silanes such as bis(dimethylketoximate)methylsilane and bis(cyclohexylketoximate)methylsilane and the like. However, the hydrosilane compound used in the method described in (a) is not limited to these compounds. Of these compounds, halogenated silanes and alkoxysilanes are preferable and in particular, alkoxysilanes are most preferable because the obtained curable compositions are moderately hydrolyzable and easily handled. Of the alkoxysilanes, methyldimethoxysilane is particularly preferable because it is easily available and curability, storage stability, elongation property and tensile strength of the curable composition containing the obtained organic polymer are high.

Examples of the synthesis method described in (b) include a method in which a mercapto group- and reactive silicon group-containing compound is introduced into the sites on the unsaturated bonds of an organic polymer by means of a radical addition reaction in the presence of a radical initiator and/or a radical generating source; however, the synthesis method concerned is not limited to these methods. Examples of the above described mercapto group- and reactive silicon group-containing compound include γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldiethoxysilane, mercaptomethyltrimethoxysilane, mercaptomethyltriethoxysilane and the like; however, the mercapto group- and reactive silicon group-containing compound is not limited to these compounds.

Examples of the method, of the methods described in (c), in which a hydroxy-terminated polymer is reacted with an isocyanate group- and reactive silicon group-containing compound include a method disclosed in Japanese Patent Laid-Open No. 3-47825; however, the method concerned is not limited to these methods. Examples of the above described isocyanate group- and reactive silicon group-containing compound include γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropylmethyldiethoxysilane, isocyanatomethyltrimethoxysilane, isocyanatomethyltriethoxysilane, isocyanatomethyldimethoxymethylsilane, isocyanatomethyldiethoxymethylsilane and the like; however, the compound concerned is not limited to these compounds.

In the case of silane compounds such as trimethoxysilane in which three hydrolyzable groups are bonded to one silicon atom, in some cases, disproportionation reaction proceeds. If disproportionation reaction proceeds, a dangerous compound like dimethoxysilane is generated. However in the cases of γ-mercaptopropyltrimethoxysilane and γ-isocyanatepropyltrimethoxysilane, such a disproportionation reaction does not proceed. Accordingly, when using, as a silicon-containing group, a group such as a trimethoxysilyl group in which three hydrolyzable groups are bonded to one silicon atom, it is preferable to employ the synthesis method of (b) or (c).

The reactive silicon group-containing organic polymer may be a straight chain or may have branches, and the number average molecular weight thereof, measured by GPC relative to polystyrene standard, is preferably of the order of 500 to 100,000, more preferably 1,000 to 50,000, particularly preferably 3,000 to 30,000. When the number average molecular weight is less than 500, it tends to be disadvantageous from the viewpoint of an elongation property of the cured article, while when the number average molecular weight exceeds 100,000, it tends to be disadvantageous from the viewpoint of workability because the viscosity becomes high.

For the purpose of obtaining a rubber-like cured article having a high strength, a high elongation property and a low elastic modulus, it is recommended that the number of reactive silicon groups contained in the organic polymer is, on average in one polymer molecule, at least one, and preferably 1.1 to 5. When the average number of reactive silicon groups contained in the molecule is less than 1, the curability becomes insufficient, and hence a satisfactory rubber elasticity behavior can hardly be exhibited. The reactive silicon group may be located at the terminal of the main chain or at the terminal of the side chain, or at the both in the organic polymer molecule chain. In particular, when the reactive silicon group is located only at the terminal of the main chain, the effective network content in the organic polymer component contained in the finally formed cured article becomes large, so that it becomes easier to obtain a rubber-like cured article having a high strength, a high elongation property and a low elastic modulus.

The above described polyoxyalkylene polymer is essentially a polymer having the repeating units represented by the general formula (5):

—R⁷—O—  (5)

wherein R⁷ is a linear or branched alkylene group having 1 to 14 carbon atoms. In the general formula (5), R⁷ is preferably a linear or branched alkylene group having 1 to 14 carbon atoms, and more preferably 2 to 4 carbon atoms. Examples of the repeating units represented by the general formula (5) include: —CH₂O—, —CH₂CH₂O—, —CH₂CH(CH₃)O—, —CH₂CH(C₂H₅)O—, —CH₂C(CH₃)₂₋₀—, —CH₂CH₂CH₂CH₂O—, and the like. The main chain skeleton of the polyoxyalkylene polymer may be formed of either only one type of repeating unit or two or more types of repeating units. In particular, in the case where the polymer is used for a sealant and the like, it is preferable that the main chain skeleton is formed of a polymer containing as the main component a propyleneoxide polymer because a polymer having such a main chain skeleton is amorphous and relatively low in viscosity.

Examples of the synthesis method of the polyoxyalkylene polymer include a polymerization method in the presence of an alkaline catalyst such as KOH; a polymerization method in the presence of a transition metal compound-porphyrin complex catalyst prepared by reacting an organoaluminum compound with porphyrin, disclosed in Japanese Patent Laid-Open No. 61-215623; polymerization methods in the presence of composite metal cyanide complex catalysts, disclosed in Japanese Patent Examined Publication Nos. 46-27250 and 59-15336, and U.S. Pat. Nos. 3,278,457, 3,278,458, 3,278,459, 3,427,256, 3,427,334, 3,427,335 and the like; a polymerization method in the presence of a catalyst composed of a polyphosphazene salt disclosed in Japanese Patent Laid-Open No. 10-273512, and a polymerization method in the presence of a catalyst composed of a phosphazene compound disclosed in Japanese Patent Laid-Open No. 11-060722. However, the method concerned is not limited to these methods.

Examples of the preparation method of the reactive silicon group-containing polyoxyalkylene polymer include the methods disclosed in Japanese Patent Examined Publication Nos. 45-36319 and 46-12154, Japanese Patent Laid-Open Nos. 50-156599, 54-6096, 55-13767, 55-13468 and 57-164123, Japanese Patent Examined Publication No. 3-2450, and U.S. Pat. Nos. 3,632,557, 4,345,053, 4,366,307 and 4,960,844; and the methods of preparing polyoxyalkylene polymers each having a high molecular weight such that the number average molecular weight is not less than 6,000 and a narrow molecular weight distribution such that the Mw/Mn value is not more than 1.6, disclosed in Japanese Patent Laid-Open Nos. 61-197631, 61-215622, 61-215623, 61-218632, 3-72527, 3-47825 and 8-231707. However, the method concerned is not limited to these methods.

The above described reactive silicon group-containing polyoxyalkylene polymers may be used either each alone or in combinations of two or more thereof.

The above described saturated hydrocarbon polymers are the polymers which substantially do not contain carbon-carbon unsaturated bonds other than aromatic rings; the polymers forming the skeletons of the saturated hydrocarbon polymers can be obtained by the methods in which (1) olefin compounds having 2 to 6 carbon atoms such as ethylene, propylene, 1-butene and isobutylene are polymerized as main monomers, and (2) diene compounds such as butadiene and isoprene are homopolymerized or copolymerized with the above described olefin compounds and then hydrogenation is applied; however, isobutylene polymers and hydrogenated polybutadiene polymers are preferable because functional groups can be easily introduced into the terminals of these polymers, the molecular weights of these polymers can be easily controlled and the number of terminal functional groups can be increased; and isobutylene polymers are particularly preferable.

The polymers having saturated hydrocarbon polymers as the main chain skeleton are characterized in that the polymers each having such a skeleton are excellent in heat resistance, weather resistance, durability and moisture blocking property.

The isobutylene polymers may be formed in such a way that all the monomer units are solely isobutylene units, or my be copolymers with monomers other than isobutylene units; however, from the viewpoint of the rubber property, in each of the polymers concerned, the content of the units derived from isobutylene is preferably not less than 50 wt %, more preferably not less than 80 wt %, and most preferably 90 to 99 wt %.

As for the synthesis methods of saturated hydrocarbon polymers, various types of polymerization methods have hitherto been reported, particularly among which are many so-called living polymerization methods developed in these years. It has been known that the saturated hydrocarbon polymers, in particular, the isobutylene polymers can be easily produced by use of the inifer polymerization discovered by Kennedy et al. (J. P. Kennedy et al., J. Polymer Sci., Polymer Chem. Ed., Vol. 15, p. 2843 (1997)) in such a way that polymers having the molecular weights of the order of 500 to 100,000 can be polymerized with the molecular weight distribution of not more than 1.5 and various types of functional groups can be introduced into the molecular terminals.

The preparation methods of the reactive silicon group-containing saturated hydrocarbon polymers are described, for example, in Japanese Patent Examined Publication Nos. 4-69659 and 7-108928, Japanese Patent Laid-Open Nos. 63-254149, 64-22904 and 1-197509, Japanese Patent Nos. 2539445 and 2873395, Japanese Patent Laid-Open No. 7-53882 and the like; however, the methods concerned are not particularly limited to these methods.

The above described reactive silicon group-containing saturated hydrocarbon polymers may be used either each alone or in combinations of two or more thereof.

No particular constraint is imposed on the (meth)acrylate monomers constituting the main chains of the above described (meth)acrylate polymers, and various types can be used. Examples of the monomers concerned include (meth)acrylic acid monomers such as (meth)acrylic acid, methyl(meth)acrylate, ethyl(meth)acrylate, n-propyl(meth)acrylate, isopropyl(meth)acrylate, n-butyl(meth)acrylate, isobutyl(meth)acrylate, tert-butyl(meth)acrylate, n-pentyl(meth)acrylate, n-hexyl(meth)acrylate, cyclohexyl(meth)acrylate, n-heptyl(meth)acrylate, n-octyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, nonyl(meth)acrylate, decyl(meth)acrylate, dodecyl(meth)acrylate, phenyl(meth)acrylate, tolyl(meth)acrylate, benzyl(meth)acrylate, 2-methoxyethyl(meth)acrylate, 3-methoxybutyl(meth)acrylate, 2-hydroxyethyl(meth)acrylate, 2-hydroxypropyl(meth)acrylate, stearyl(meth)acrylate, glycidyl(meth)acrylate, 2-aminoethyl(meth)acrylate, γ-(methacryloyloxypropyl)trimethoxysilane, γ-(methacryloyloxypropyl)dimethoxymethylsilane, methacryloyloxymethyltrimethoxysilane, methacryloyloxymethyltriethoxysilane, methacryloyloxymethyldimethoxymethylsilane, methacryloyloxymethyldiethoxymethylsilane, ethylene oxide adduct of (meth)acrylate, trifluoromethylmethyl(meth)acrylate, 2-trifluoromethylethyl(meth)acrylate, 2-perfluoroethylethyl(meth)acrylate, 2-perfluoroethyl-2-perfluorobutylethyl(meth)acrylate, perfluoroethyl(meth)acrylate, trifluoromethyl(meth)acrylate, bis(trifluoromethly)methyl(meth)acrylate, trifluoromethylperfluoroethylmethyl(meth)acrylate, 2-perfluorohexylethyl(meth)acrylate, 2-perfluorodecylethyl(meth)acrylate and 2-perfluorohexadecylethyl(meth)acrylate. For the above described (meth)acrylate polymers, (meth)acrylate monomers can be copolymerized with the following vinyl monomers. Examples of the vinyl monomers concerned include styrene monomers such as styrene, vinyltoluene, α-methylstyrene, chlorostyrene, styrenesulfonic acid and the salts thereof; fluorine-containing vinyl monomers such as perfluoroethylene, perfluoropropylene and fluorinated vinylidene; silicon-containing vinyl monomers such as vinyltrimethoxysilane and vinyltriethoxysilane; maleic anhydride, maleic acid, and monoalkyl esters and dialkyl esters of maleic acid; fumaric acid, and monoalkyl esters and dialkyl esters of fumaric acid; maleimide monomers such as maleimide, methylmaleimide, ethylmaleimide, propylmaleimide, butylmaleimide, hexylmaleimide, octylmaleimide, dodecylmaleimide, stearylmaleimide, phenylmaleimide and cyclohexylmaleimide; nitrile group-containing vinyl monomers such as acrylonitrile and methacrylonitrile; amide group-containing vinyl monomers such as acrylamide and methacrylamide; vinyl esters such as vinyl acetate, vinyl propionate, vinyl pivalate, vinyl benzoate and vinyl cinnamate; alkenes such as ethylene and propylene; conjugated dienes such as butadiene and isoprene; and vinyl chloride, vinylidene chloride, allyl chloride and allyl alcohol. These monomers may be used each alone or two or more of these monomers may be copolymerized. Among these, from the viewpoint of the physical properties of the products, polymers formed of styrene monomers and (meth)acrylic acid monomers are preferable. More preferable are the (meth)acryl polymers formed of acrylate monomers and methacrylate monomers, and particularly preferable are the acryl polymers formed of acrylate monomers. For general construction applications, the butyl acrylate monomers are further preferable because compositions concerned each are required to have physical properties including a low viscosity, and the cured articles each are required to have physical properties including a low modulus, a high elongation property, a weather resistance and a heat resistance. On the other hand, for applications to vehicles and the like where oil resistance is required, copolymers made of ethyl acrylate as the main material are further preferable. The copolymers made of ethyl acrylate as the main material are excellent in oil resistance, but slightly tend to be poor in low-temperature property (low-temperature resistance); for the purpose of improving the low-temperature property thereof, a part of ethyl acrylates can be replaced with butyl acrylate. However, with the increase of the ratio of butyl acrylate, the satisfactory oil resistance comes to be degraded, so that for the application to the use requiring oil resistance, the ratio of butyl acrylate is set preferably to not more than 40%, and more preferably to not more than 30%. Additionally, it is also preferable to use 2-methoxyethyl acrylate and 2-ethoxyethyl acrylate which have side chain alkyl groups containing oxygen atoms introduced for the purpose of improving the low-temperature property and the like without degrading the oil resistance; in this connection, it is to be noted that the introduction of alkoxy groups having an ether bond in the side chains tends to degrade the heat resistance, so that the ratio of such an acrylate is preferably not more than 40% when heat resistance is required. It is possible to obtain appropriate polymers by varying the ratio in consideration of required physical properties such as oil resistance, heat resistance and low-temperature property according to the various applications and the required objectives. Examples of the polymers excellent in the balance between the physical properties including the oil resistance, heat resistance, low-temperature property and the like include a copolymer of ethyl acrylate/butyl acrylate/2-methoxyethyl acrylate (40 to 50/20 to 30/30 to 20 in a ratio by weight), this copolymer imposing no constraint on the polymers concerned. In the present invention, these preferable monomers can be copolymerized with other monomers, and moreover, block copolymerized with other monomers. In such cases, it is preferable that the preferable monomers are contained in an amount of not less than 40% in a ratio by weight. Incidentally, it is to be noted that in the above form of presentation, for example, “(meth)acrylic acid” means acrylic acid and/or methacrylic acid.

No particular constraint is imposed on the synthesis methods of the (meth)acrylate polymers, and the methods well known in the art can be applied. However, polymers obtained by the usual free radical polymerization methods using azo compounds and peroxides as polymerization initiators have a problem such that the molecular weight distribution values of the polymers are generally as large as not less than 2 and the viscosities of the polymers are high. Accordingly, it is preferable to apply living radical polymerization methods for the purpose of obtaining (meth)acrylate polymers being narrow in molecular weight distribution and low in viscosity, and moreover, having cross-linking functional groups at the molecular chain terminals in a high ratio.

Among “the living radical polymerization methods,” “the atom transfer radical polymerization method” in which (meth)acrylate monomers are polymerized by use of an organic halogenated compound or a halogenated sulfonyl compound as an initiator and a transition metal complex as a catalyst has, in addition to the features of the above described “living radical polymerization methods,” features such that the obtained polymer has halogen atoms at the terminals relatively favorable for the functional group conversion reaction and freedom for designing the initiator and the catalyst is wide, so that the atom transfer radical polymerization method is further preferable as a method for preparing (meth)acrylate polymers having particular functional groups. Examples of the atom transfer radical polymerization method include the method reported by Matyjaszewski et al. in Journal of the American Chemical Society (J. Am. Chem. Soc.), Vol. 117, p. 5614 (1995).

As a preparation method of a reactive silicon group-containing (meth)acrylate polymer, for example, Japanese Patent Examined Publication Nos. 3-14068 and 4-55444, and Japanese Patent Laid-Open No. 6-211922 and the like disclose preparation methods according to the free radical polymerization methods by using chain transfer agents. Additionally, Japanese Patent Laid-Open No. 9-272714 and the like disclose a preparation method according to the atom transfer radical polymerization method. However, the preparation method concerned is not limited to these methods.

The above described reactive silicon group-containing (meth)acrylate polymers may be used either each alone or in combinations of two or more thereof.

These reactive silicon group-containing organic polymers may be used either each alone or in combinations of two or more thereof. Specifically, there can be used organic polymers formed by blending two or more polymers selected from the group consisting of the reactive silicon group-containing polyoxyalkylene polymers, the reactive silicon group-containing saturated hydrocarbon polymers and the reactive silicon group-containing (meth)acrylate polymers.

The preparation methods of the organic polymers formed by blending the reactive silicon group-containing polyoxyalkylene polymers with the reactive silicon group-containing (meth)acrylate polymers are proposed in Japanese Patent Laid-Open Nos. 59-122541, 63-112642, 6-172631, 11-116763 and the like. However, the preparation method concerned is not limited to these methods. A preferable specific example is a preparation method in which a reactive silicon group-containing polyoxyalkylene polymer is blended with a copolymer formed of two (meth)acrylate monomer units: one (meth)acrylate monomer unit has the reactive silicon groups and alkyl groups having 1 to 8 carbon atoms, and the molecular chain is substantially represented by the following general formula (6):

—CH₂—C(R⁸)(COOR⁹)—  (6)

wherein R⁸ represents hydrogen atom or a methyl group, and R⁹ represents an alkyl group having 1 to 8 carbon atoms; and the other (meth)acrylate monomer unit has alkyl groups having 10 or more carbon atoms and is represented by the following formula (7):

—CH₂—C(R⁸)(COOR¹⁰)—  (7)

wherein R⁸ is the same as defined above, and R¹⁰ represents an alkyl group having 10 or more carbon atoms.

In the above general formula (6), examples of R⁹ include alkyl groups having 1 to 8 carbon atoms, preferably 1 to 4 carbon atoms and further preferably 1 to 2 carbon atoms such as a methyl group, an ethyl group, a propyl group, a n-butyl group, a t-butyl group and a 2-ethylhexyl group. It is also to be noted that the alkyl group of R⁹ may represent either one type or admixtures of two or more types.

In the above general formula (7), examples of R¹⁰ include long chain alkyl groups having 10 or more carbon atoms, usually 10 to 30 carbon atoms, and preferably 10 to 20 carbon atoms such as a lauryl group, a tridecyl group, a cetyl group, a stearyl group and a behenyl group. It is also to be noted that the alkyl group of R¹⁰ may represent, similarly to R⁹, either one type or admixtures of two or more types.

The molecular chains of the above described (meth)acrylate copolymers are substantially formed of the monomer units represented by formulas (6) and (7): “substantially” as referred to here means that in the copolymer concerned, the sum content of the monomer unit of formula (6) and the monomer unit of formula (7) exceeds 50 wt %. The sum content of the monomer units of formulas (6) and (7) is preferably not less than 70 wt %.

Additionally, the abundance ratio by weight of the monomer unit of formula (6) to the monomer unit of formula (7) is preferably 95:5 to 40:60, and further preferably 90:10 to 60:40.

Examples of the monomer units other than the monomer units of formulas (6) and (7) which may be contained in the above described copolymer include acrylic acids such as acrylic acid and methacrylic acid; monomers containing amide groups such as acrylamide, methacrylamide, N-methylolacrylamide and N-methylolmethacrylamide, monomers containing epoxy groups such as glycidylacrylate and glycidylmethacrylate, and monomers containing amino groups such as diethylaminoethyl acrylate, diethylaminoethyl methacrylate and aminoethyl vinyl ether; and monomer units derived from acrylonitrile, styrene, α-methylstyrene, alkyl vinyl ethers, vinyl chloride, vinyl acetate, vinyl propionate and ethylene.

The organic polymers formed by blending a reactive silicon group-containing saturated hydrocarbon polymer with a reactive silicon group-containing (meth)acrylate copolymer are proposed in Japanese Patent Laid-Open Nos. 1-168764, 2000-186176 and the like. However the organic polymer concerned is not limited to these organic polymers.

Moreover, for the preparation method of the organic polymers formed by blending the (meth)acrylate copolymers having the reactive silicon functional groups, there can be used additional methods in which (meth)acrylate monomers are polymerized in the presence of a reactive silicon group-containing organic polymer. These methods are disclosed specifically in Japanese Patent Laid-Open Nos. 59-78223, 59-168014, 60-228516, 60-228517 and the like. However, the method concerned is not limited to these methods.

The main chain skeleton of the organic polymer may include other components such as binding urethane components as far as such inclusion does not largely impair the effect of the present invention.

No particular constraint is imposed on the binding urethane components. Examples thereof include groups (hereinafter referred to as amide segments) formed by a reaction of an isocyanate group with an active hydrogen group.

The above described amide segments are groups represented by the general formula (8):

—NR¹¹—C(═O)—  (8)

wherein R¹¹ represents hydrogen atom or a substituted or unsubstituted organic group.

Examples of the above described amide segments include a urethane group formed by a reaction of an isocyanate group with hydroxyl group; a urea group formed by a reaction of an isocyanate group with an amino group; a thiourethane group formed by a reaction of an isocyanate group with a mercapto group; and the like. Additionally, in the present invention, groups formed by further reaction of an active hydrogen in the urethane group, urea group or thiourethane group with an isocyanate group are included in the groups of the general formula (10).

Example of an industrially easy method of preparing an organic polymer having both of an amide segment and a reactive silicon group is a method in which after or at the same time of reacting an organic polymer having an active hydrogen-containing group at the terminal with an excessive amount of polyisocyanate compound to yield a polymer having isocyanate groups at the terminals of polyurethane main chains, a part or the whole of isocyanate groups are reacted with a W group of the silicon compound represented by the general formula (9):

W—R¹²—SiR⁶ _(3-c)X_(c)  (9)

wherein R⁶, X and c are the same as defined above; R¹² is a divalent organic group, more preferably a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms; W is an active hydrogen-containing group selected from hydroxyl group, a carboxyl group, a mercapto group and an amino group (unsubstituted or mono-substituted). Known methods of preparing organic polymers in relation to this preparation method are disclosed in Japanese Patent Examined Publication No. 46-12154 (U.S. Pat. No. 3,632,557), Japanese Patent Laid-Open Nos. 58-109529 (U.S. Pat. No. 4,374,237), 62-13430 (U.S. Pat. No. 4,645,816), 8-53528 (EP Patent No. 0676403), and 10-204144 (EP Patent No. 0831108), Japanese Patent Laid-Open No. 2003-508561 (U.S. Pat. No. 6,197,912), Japanese Patent Laid-Open Nos. 6-211879 (U.S. Pat. No. 5,364,955), 10-53637 (U.S. Pat. No. 5,756,751), 11-100427, 2000-169544, 2000-169545, and 2002-212415, Japanese Patent No. 3313360, U.S. Pat. No. 4,067,844, U.S. Pat. No. 3,711,445, Japanese Patent Laid-Open No. 2001-323040 and the like.

Additionally, there are methods of preparation by reacting an organic polymer having an active hydrogen-containing group at the terminal with a reactive silicon group-containing isocyanate compound represented by the general formula (10):

O═C═N—R¹²—SiR⁶ _(3-c)X_(c)  (10)

wherein R⁶, R¹², X and c are the same as defined above. Known methods of preparing organic polymers in relation to this preparation method are disclosed in Japanese Patent Laid-Open Nos. 11-279249 (U.S. Pat. No. 5,990,257), 2000-119365 (U.S. Pat. No. 6,046,270), 58-29818 (U.S. Pat. No. 4,345,053), 3-47825 (U.S. Pat. No. 5,068,304), 11-60724, 2002-155145, 2002-249538, WO03/018658, WO03/059981 and the like.

Examples of the organic polymers having an active hydrogen-containing group at the terminal include oxyalkylene polymers (polyether polyols) having hydroxyl group at the terminal, polyacryl polyols and polyester polyols, saturated hydrocarbon polymers (polyolefin polyols) having hydroxyl group at the terminal, polythiol compounds, polyamine compounds and the like. Among them, polyether polyols, polyacryl polyols and polyolefin polyols are preferable because the glass transition temperature of the obtained organic polymers is relatively low and the obtained cured articles are excellent in cold resistance. Particularly polyether polyols are preferable because a viscosity of the obtained organic polymers is low, workability is good and deep-part curability is good. Additionally polyacryl polyols and saturated hydrocarbon polymers are more preferable because weather resistance and heat resistance of the cured articles obtained from the organic polymers are good.

Polyether polyols prepared by any of preparation methods can be used, and preferred are polyether polyols having at least 0.7 hydroxyl group per a molecular terminal on average of the whole molecules. Specifically, examples thereof are oxyalkylene polymers prepared by using conventional alkali metal catalysts, oxyalkylene polymers prepared by reacting an initiator such as a polyhydroxy compound having at least two hydroxyl groups with alkylene oxide in the presence of a composite metal cyanide complex and cesium, and the like.

Of the above described polymerization methods, the method using a composite metal cyanide complex is preferable because oxyalkylene polymers having a lower degree of unsaturation, a narrow Mw/Mn, a lower viscosity and high acid resistance and weather resistance can be obtained.

Examples of the above described polyacryl polyols include polyols having an alkyl(meth)acrylate (co)polymer skeleton and containing hydroxy groups in the molecule. As the synthesis method to produce these polymers, the living radical polymerization method is preferable because this method can lead to narrow molecular weight distributions and low viscosities, and the atom transfer radical polymerization method is further preferable. Additionally, it is preferable to use a polymer based on the so-called SGO process which is obtained by continuously block-polymerizing an alkyl acrylate monomer at a high temperature under a high pressure, as described in Japanese Patent Laid-Open No. 2001-207157. Specifically, examples thereof include UH-2000 produced by Toagosei Co., Ltd., and the like.

Examples of the polyisocyanate compound include aromatic polyisocyanates such as toluene (tolylene)diisocyanate, diphenylmethane diisocyanate and xylylene diisocyanate; and aliphatic polyisocyanates such as isophorone diisocyanate and hexamethylene diisocyanate.

No particular constraint is imposed on the silicon compound of the general formula (9). Specifically, examples thereof include silanes having amino group such as γ-aminopropyltrimethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, γ-(N-phenyl)aminopropyltrimethoxysilane, N-ethylaminoisobutyltrimethoxysilane, N-cyclohexylaminomethyltriethoxysilane, N-cyclohexylaminomethyldiethoxymethylsilane and N-phenylaminomethyltrimethoxysilane; silanes having hydroxy group such as γ-hydroxypropyltrimethoxysilane; silanes having mercapto group such as γ-mercaptopropyltrimethoxysilane; and the like. Additionally, as described in Japanese Patent Laid-Open Nos. 6-211879 (U.S. Pat. No. 5,364,955), 10-53637 (U.S. Pat. No. 5,756,751), 10-204144 (EP Patent No. 0831108), 2000-169544 and 2000-169545, there can be used Michael addition reaction products of various α,β-unsaturated carbonyl compounds and primary amino group-containing silanes and Michael addition reaction products of various (meth)acryloyl group-containing silanes and primary amino group-containing compounds as the silicon compounds of the general formula (9).

No particular constraint is imposed on the reactive silicon group-containing isocyanate compound of the general formula (10). Specifically, examples thereof include γ-trimethoxysilylpropylisocyanate, γ-triethoxysilylpropylisocyanate, γ-methyldimethoxysilylpropylisocyanate, γ-methyldiethoxysilylpropylisocyanate, trimethoxysilylmethylisocyanate, diethoxymethylsilylmethylisocyanate, dimethoxymethylsilylmethylisocyanate, diethoxymethylsilylmethylisocyanate and the like. Additionally, as described in Japanese Patent Laid-Open No. 2000-119365 (U.S. Pat. No. 6,046,270), a compound obtained by reacting the silicon compound of the general formula (9) with an excessive amount of the above described polyisocyanate compound can be used as the reactive silicon group-containing isocyanate compound of the general formula (10).

When amide segments contained in the main chain skeleton of the organic polymer of the component (A) of the present invention are abundant, the viscosity of the organic polymer becomes high and forms a composition poor in workability as the case may be. On the other hand, curability of the composition of the present invention tends to be enhanced by the amide segments contained in the main chain skeleton of the component (A). Accordingly, when the organic polymer having amide segments in its main chain skeleton is used as the component (A), the composition prepared in a combination of the polymer with the titanium chelate (B) is preferable because the composition has a quicker curability by use of a non-organotin catalyst. When the amide segments are contained in the main chain skeleton of the component (A), the average number of amide segments per molecule is preferably from 1 to 10, more preferably from 1.5 to 7, particularly preferably from 2 to 5. When the number of amide segments is less than 1, in some cases, curability becomes insufficient, and when the number of amide segments is more than 10, the viscosity of the organic polymer becomes high and forms a composition poor in workability.

In the present invention, the titanium chelate represented by the following general formula (1) or (2) is used as the component (B).

General formula (1):

wherein each of n R¹s is independently a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, each of (4-n) R²s is independently hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, each of (4-n) A¹s and (4-n) A²s is independently —R³ or —OR³ where R³ is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, n is 1, 2 or 3. General formula (2):

wherein R², A¹ and A² are the same as defined above, R⁴ is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms.

This titanium chelate (B) functions as a curing catalyst for the organic polymer of the component (A). Organotin compounds such as dibutyltin dilaurate and dibutyltin bis(acetylacetonate) which have a fear of having an influence on environment have been so far used as a curing catalyst for the reactive silicon group-containing organic polymer of the component (A), but by using the titanium chelate (B) of the present invention, a load on environment is small and a curable composition having practical curing properties can be obtained. Titanium chelate is a kind of titanium catalysts, and tetraalkoxy titanium, halogenated titanium and the like are known as a titanium catalyst other than titanium chelates. In the present invention, by use of the titanium chelate (B), a curable composition having good curability and storage stability can be obtained as compared with the case of using other titanium catalysts. From the viewpoint of especially high catalytic activity, compounds of the general formula (1) are more preferable. Additionally, when tetraalkoxy titanium is used, in some cases, an extreme increase in viscosity arises when it is brought into contact with the reactive silicon group-containing organic polymer. However such a phenomenon does not arise when the titanium chelate (B) is used. Further as compared with the case of using other curing catalysts such as organotin catalysts, adhesion to articles to be hardly adhered such as acrylic resins can be enhanced.

Examples of the titanium chelates of the component (B) include titanium dimethoxidebis(ethylacetoacetate), titanium dimethoxidebis(acetylacetonate), titanium diethoxidebis(ethylacetoacetate), titanium diethoxidebis(acetylacetonate), titanium diisopropoxidebis(ethylacetoacetate), titanium diisopropoxidebis(methylacetoacetate), titanium diisopropoxidebis(t-butylacetoacetate), titanium diisopropoxidebis(methyl-3-oxo-4,4-dimethylhexanoate), titanium diisopropoxidebis(ethyl-3-oxo-4,4,4-trifluorobutanoate), titanium diisopropoxidebis(acetylacetonate), titanium diisopropoxidebis(2,2,6,6-tetramethyl-3,5-heptanedionate), titanium di-n-butoxidebis(ethylacetoacetate), titanium di-n-butoxidebis(acetylacetonate), titanium diisobutoxidebis(ethylacetoacetate), titanium diisobutoxidebis(acetylacetonate), titanium di-t-butoxidebis(ethylacetoacetate), titanium di-t-butoxidebis(acetylacetonate), titanium bis(2-ethylhexoxide)bis(ethylacetoacetate), titanium bis(2-ethylhexoxide)bis(acetylacetonate), titanium bis(1-methoxy-2-propoxide)bis(ethylacetoacetate), titanium bis(3-oxo-2-butoxide)bis(ethylacetoacetate), titanium bis(3-diethylaminopropoxide)bis(ethylacetoacetate), titanium bis(trimethylsiloxy)bis(ethylacetoacetate), titanium bis(trimethylsiloxy)bis(acetylacetonate), titanium triisopropoxide(ethylacetoacetate), titanium triisopropoxide(diethylmalonate), titanium triisopropoxide(allylacetoacetate), titanium triisopropoxide(methacryloxyethylacetoacetate), 1,2-dioxyethanetitaniumbis(ethylacetoacetate), 1,3-dioxypropanetitaniumbis(ethylacetoacetate), 2,4-dioxypentanetitaniumbis(ethylacetoacetate), 2,4-dimethyl-2,4-dioxypentanetitaniumbis(ethylacetoacetate), titanium diisopropoxidebis(triethanolaminate) and the like. Of these titanium chelates, specifically preferred are titanium diethoxidebis(ethylacetoacetate), titanium diethoxidebis(acetylacetonate), titanium diisopropoxidebis(ethylacetoacetate), titanium diisopropoxidebis(acetylacetonate), titanium dibutoxidebis(ethylacetoacetate) and titanium dibutoxidebis(acetylacetonate) because those titanium chelates are easily available and also from the viewpoint of catalytic activity. More preferred are titanium diethoxidebis(ethylacetoacetate), titanium diisopropoxidebis(ethylacetoacetate) and titanium dibutoxidebis(ethylacetoacetate), and most preferred is titanium diisopropoxidebis(ethylacetoacetate).

Preferred examples of the chelating agents capable of forming chelate ligands of the above described titanium chelates include β-diketones such as acetylacetone and 2,2,4,4-tetramethyl-3,5-heptanedion; β-ketoesters such as methyl acetoacetate, ethyl acetoacetate, t-butyl acetoacetate, allyl acetoacetate, (2-methacryloxyethyl)acetoacetate, methyl 3-oxo-4,4-dimethylhexanoate, ethyl 3-oxo-4,4,4-trifluorobutanoate and 3-methylacetylacetone; β-diesters such as dimethyl malonate and diethyl malonate; cyclic dicarbonyl compounds such as 2-acetylbutyrolactone; and the like from the viewpoint of curability. β-Diketones and β-ketoesters are more preferred from the viewpoint of curability and storage stability, and β-ketoesters are particularly preferred. Specifically acetylacetone, methyl acetoacetate and ethyl acetoacetate are more preferred from the viewpoint of curability and storage stability and because those compounds are easily available, and ethyl acetoacetate is particularly preferable. Also when two or more chelate ligands are present, those chelate ligands may be the same or different.

As a method of adding the titanium chelates of the component (B), in addition to a method of directly adding the above described titanium chelates, there can be used a method of adding a chelating agent such as ethyl acetoacetate and a titanium compound reactable with the chelating agent such as titanium tetraisopropoxide or titanium dichloride diisopropoxide to the composition of the present invention to subject the titanium compound to chelating in a composition in situ.

The titanium chelates of the component (B) may be used either each alone or in combinations of two or more thereof.

The used amount of the component (B) is preferably 0.1 to 20 parts by weight, and more preferably 0.5 to 15 parts by weight, especially preferably 1 to 10 parts by weight with respect to 100 parts by weight of the component (A). When the blended amount of the component (B) is less than the above described ranges, sometimes the practical curing rate cannot be obtained, and the curing reaction hardly proceeds to a sufficient extent. On the other hand, when the blended amount of the component (B) exceeds the above described ranges, there is a tendency that the work life becomes too short, the workability is degraded and storage stability is lowered.

In the present invention, a titanium catalyst other than the component (B) can be used to an extent not to degrade the effect of the present invention.

Examples thereof include titanium alkoxides such as titanium tetramethoxide, titanium tetraethoxide, titanium allyloxide, titanium tetra-n-propoxide, titanium tetraisopropoxide, titanium tetra-n-butoxide, titanium tetraisobutoxide, titanium tetra-sec-butoxide, titanium tetra-t-butoxide, titanium tetra-n-pentyloxide, titanium tetracyclopentyloxide, titanium tetrahexyloxide, titanium tetracyclohexyloxide, titanium tetrabenzyloxide, titanium tetraoctyloxide, titanium tetrakis(2-ethylhexyloxide), titanium tetradecyloxide, titanium tetradodecyloxide, titanium tetrastearyloxide, titanium tetrakis(trimethylsilyloxide), titanium tetrabutoxide dimer, titanium tetrakis(8-hydroxyoctyloxide), titanium diisopropoxidebis(2-ethyl-1,3-hexanediolate), titanium bis(2-ethylhexyloxy)bis(2-ethyl-1,3-hexanediolate), titanium tetrakis(2-chloroethoxide), titanium tetrakis(2-bromoethoxide), titanium tetrakis(2-methoxyethoxide), titanium tetrakis(2-ethoxyethoxide), titanium butoxidetrimethoxide, titanium dibutoxidedimethoxide, titanium butoxidetriethoxide, titanium dibutoxidediethoxide, titanium butoxidetriisopropoxide, titanium dibutoxidediisopropoxide, titanium tetraphenoxide, titanium tetrakis(o-chlorophenoxide), titanium tetrakis(m-nitrophenoxide) and titanium tetrakis(p-methylphenoxide); titanium acylates such as titanium acrylate triisopropoxide, titanium methacrylate triisopropoxide, titanium dimethacrylate diisopropoxide, titanium trimethacrylate isopropoxide, titanium hexanoate triisopropoxide and titanium stearate triisopropoxide; halogenated titanates such as titanium chloride triisopropoxide, titanium dichloride diisopropoxide, titanium isopropoxide trichloride, titanium bromide triisopropoxide, titanium fluoride triisopropoxide, titanium chloride triethoxide and titanium chloride tributoxide; other titanates such as titanium tris(dioctylphosphate)isopropoxide, titanium tris(dodecylbenzenesulfonate)isopropoxide and dihydroxytitaniumbislactate; and the like.

In the present invention, a high molecular weight plasticizer having a number average molecular weight of 1,000 to 15,000 is used as the component (C). The high molecular weight plasticizer is a high molecular weight compound which has a number average molecular weight of 1,000 to 15,000 and substantially does not contain a reactive silicon group. By the addition of the component (C), a viscosity and thixotropy of the curable composition of the present invention can be adjusted, and also mechanical properties such as a tensile strength and elongation of a cured article obtained by curing the composition can be adjusted. Herein “substantially does not contain a reactive silicon group” means that the number of reactive silicon groups of the general formula (3) in one molecule of the high molecular weight plasticizer is less than 1 on average. The number of reactive silicon groups is preferably less than 0.5, more preferably less than 0.2, particularly preferably less than 0.1, and it is most preferable that no reactive silicon groups are contained. When a high molecular weight plasticizer containing less than 1 reactive silicon group in one molecule thereof is used, an effect of enhancing elongation of the obtained cured article can be obtained. However if 1 or more reactive silicon groups are present on average in one molecule of a high molecular weight plasticizer, there is a tendency that its effect is lowered, and cost becomes high.

In general, a viscosity and slump property of curable compositions and mechanical properties such as a tensile strength and elongation of cured articles obtained by curing the compositions can be adjusted by adding a plasticizer to the curable compositions. Plasticizers usually used well are phthalic acid ester plasticizers. However when the component (B) of the present invention is used as a curing catalyst and a phthalic acid ester plasticizer is used, in some cases, an obtained curable composition does not exhibit sufficient adhesion. On the other hand, by using the high molecular weight plasticizer of the component (C) as a plasticizer of the curable composition of the present invention, an effect of improving adhesion can be obtained in the case of use of the titanium chelate of the component (B). Additionally, by use of the high molecular weight plasticizer, also there can be obtained effects of inhibiting curing retardation and improving drying property (also called coating property) in the case of coating of an alkyd coating material on the cured article.

Examples of the high molecular weight plasticizer include vinyl polymers obtained by polymerizing vinyl monomers by means of various methods; polyester plasticizers obtained from dibasic acids such as sebacic acid, adipic acid, azelaic acid and phthalic acid and dihydric alcohols such as ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol and dipropylene glycol; polyethers including polyether polyols each having a molecular weight of not less than 500, additionally not less than 1000 such as polyethylene glycol, polypropylene glycol and polytetramethylene glycol, and the derivatives of these polyether polyols in which the hydroxy groups in these polyether polyols are substituted with acyl groups such as an acetoxy group, alkoxy groups such as a methoxy group, an ethoxy group, a butoxy group and an allyloxy group and the like; polystyrenes such as polystyrene and poly-α-methylstyrene; and polybutadiene, polybutene, polyisobutylene, butadiene-acrylonitrile and polychloroprene. However, the polymer plasticizer concerned is not limited to these examples.

Of those high molecular weight plasticizers, those having, in the main chain thereof, a polyether structure such as polyethylene glycol and polypropylene glycol are more preferable from the viewpoint of a high effect of improving adhesion, and polyether derivatives having no hydroxyl groups are particularly preferable because of good storage stability. Specifically high molecular weight plasticizers obtained by modifying a hydroxyl group of polypropylene glycol to a methoxy group, a butoxy group, an allyloxy group or the like are preferable.

Of these polymer plasticizers, the polymer plasticizers which are compatible with the polymer of component (A) are preferable. In this regard, polyethers and vinyl polymers are preferable. Additionally, the use of polyethers as plasticizers improves the surface curability and deep-part curability, and causes no curing retardation after storage, and hence polyethers are preferable; of polyethers, polypropylene glycol is more preferable. Additionally, from the viewpoint of the compatibility, weather resistance and heat resistance, vinyl polymers are preferable. Of the vinyl polymers, acryl polymers and/or methacryl polymers are preferable, and acryl polymers such as polyalkylacrylate are further preferable. As the polymerization method to produce acryl polymers, the living radical polymerization method is preferable because this method can lead to narrow molecular weight distributions and low viscosities, and the atom transfer radical polymerization method is further preferable. Additionally, it is preferable to use a polymer based on the so-called SGO process which is obtained by continuously block-polymerizing an alkyl acrylate monomer at a high temperature under a high pressure, as described in Japanese Patent Laid-Open No. 2001-207157.

The number average molecular weight of the high molecular weight plasticizer is preferably 1,000 to 15,000, more preferably 1,000 to 10,000, further preferably 1,000 to 8,000, particularly preferably 1,000 to 5,000. When the molecular weight is too low, the plasticizer is removed with time due to heat and by rainfall, and hence it is made impossible to maintain the initial physical properties over a long period of time, and as a result, contamination attributable to cohesion of dusts is caused and the coating property with an alkyd coating material cannot be improved. On the other hand, when the molecular weight is too high, the viscosity becomes high and the workability is degraded. No particular constraint is imposed on the molecular weight distribution of the polymer plasticizer. However, it is preferable that the molecular weight distribution is narrow; the molecular weight distribution is preferably less than 1.80, more preferably not more than 1.70, further preferably not more than 1.60, yet further preferably not more than 1.50, particularly preferably not more than 1.40 and most preferably not more than 1.30.

The number average molecular weight of a polyether polymer is measured with the terminal group analysis method, and that of other polymer is measured with the GPC method. Additionally, the molecular weight distribution (Mw/Mn) is measured with the GPC method (relative to polystyrene standard).

The high molecular weight plasticizers of the component (C) may be used either each alone or in combinations of two or more thereof.

The used amount of the component (C) is 5 to 150 parts by weight, preferably 10 to 120 parts by weight, and further preferably 20 to 100 parts by weight, with respect to 100 parts by weight of the polymer of the component (A). When the used amount is less than 5 parts by weight, the effect as the plasticizer is not exhibited, while when the used amount exceeds 150 parts by weight, the mechanical strength of the cured article is insufficient.

Additionally, plasticizers other than the component (C) can be used to an extent not to degrade the effect of the present invention. Examples thereof include phthalic acid esters such as dibutyl phthalate, diheptyl phthalate, bis(2-ethylhexyl)phthalate, diisodecyl phthalate, diundecyl phthalate and butylbenzyl phthalate; non-aromatic dibasic acid esters such as dioctyl adipate, dioctyl sebacate, dibutyl sebacate and diisodecyl succinate; aliphatic esters such as butyl oleate and methyl acetyl ricinolate; esters of polyalkylene glycol such as diethylene glycol dibenzoate, triethylene glycol dibenzoate and pentaerythritol ester; phosphoric acid esters such as tricresyl phosphate and tributyl phosphate; sulfonic acid esters; trimellitic acid esters; chlorinated paraffins; hydrocarbon oils such as alkyldiphenyl and partially hydrogenated terphenyl; process oils; and epoxy plasticizers such as epoxidized soybean oil and epoxystearic acid benzyl.

In the preferred embodiment of the present invention, the composition further contains a silane coupling agent as the component (D). The silane coupling agent used herein is a compound having a reactive silicon group and other functional groups in the molecule. When the composition is used to various types of articles to be adhered, namely, inorganic substrates made of glass, aluminum, stainless steel, zinc, copper and mortar and organic substrates made of polyvinyl chloride, acrylic resin, polyester, polyethylene, polypropylene and polycarbonatea, marked adhesion improvement effect is exhibited under either non-primer conditions or primer-treatment conditions. When the silane coupling agent is applied under non-primer conditions, improvement effect of adhesion to various articles to be adhered is particularly remarkable. In addition, the silane coupling agent is a compound being capable of functioning as a physical property-imparting agent, a dispersibility improver for inorganic fillers and the like.

Examples of the reactive silicon group of the silane coupling agent include groups represented by the general formula (3), in which X is a hydrolyzable group. Specifically, examples of the hydrolyzable group include those exemplified supra as a hydrolyzable group. More specifically, a methoxy group and an ethoxy group are preferable from the viewpoint of a hydrolyzation rate. The number of hydrolyzable groups is preferably not less than 2, particularly preferably not less than 3.

Examples of the functional groups other than hydrolyzable silicon groups include saturated or unsaturated amino groups, mercapto groups, epoxy groups, carboxyl groups, vinyl groups, isocyanate groups, isocyanurate, halogens and the like. Among them, saturated or unsaturated amino groups, epoxy groups, isocyanate groups and isocyanurate are preferred because an effect of improving adhesion is high, and amino groups are particularly preferred.

Specific examples of the silane coupling agent include isocyanate group-containing silanes such as γ-isocyanatepropyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-isocyanatepropylmethyldiethoxysilane, γ-isocyanatepropylmethyldimethoxysilane, (isocyanatemethyl)trimethoxysilane, (isocyanatemethyl)dimethoxymethylsilane, isocyanatemethyltriethoxysilane, and isocyanatemethyldiethoxymethylsilane; amino group-containing silanes such as γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltriisopropoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropyltriethoxysilane, γ-(2-aminoethyl)aminopropylmethyldiethoxysilane, γ-(2-aminoethyl)aminopropyltriisopropoxysilane, γ-(2-(2-aminoethyl)aminoethyl)aminopropyltrimethoxysilane, γ-(6-aminohexyl)aminopropyltrimethoxysilane, 3-(N-ethylamino)-2-methylpropyltrimethoxysilane, γ-ureidopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-benzyl-γ-aminopropyltrimethoxysilane, N-vinylbenzyl-γ-aminopropyltriethoxysilane, N-cyclohexylaminomethyltriethoxysilane, N-cyclohexylaminomethyldiethoxymethylsilane, N-phenylaminomethyltrimethoxysilane, (2-aminoethyl)aminomethyltrimethoxysilane and N,N′-bis[3-(trimethoxysilyl)propyl]ethylenediamine; ketimine type silanes such as N-(1,3-dimethylbutylidene)-3-(triethoxysilyl)-1-propaneamine; mercapto group-containing silanes such as γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane, mercaptomethyltrimethoxysilane and mercaptomethyltriethoxysilane; epoxy group-containing silanes such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and β-(3,4-epoxycyclohexyl)ethyltriethoxysilane; carboxysilanes such as β-carboxyethyltriethoxysilane, β-carboxyethylphenylbis(2-methoxyethoxy)silane and N-β-(carboxymethyl)aminoethyl-γ-aminopropyltrimethoxysilane; vinyl-type unsaturated group-containing silanes such as vinyltrimethoxysilane, vinyltriethoxysilane, γ-methacryloyloxypropylmethyldimethoxysilane, γ-acryloyloxypropyltriethoxysilane and methacryloyloxymethyltrimethoxysilane; halogen-containing silanes such as γ-chloropropyltrimethoxysilane; and isocyanurate silanes such as tris(3-trimethoxysilylpropyl)isocyanurate, and the like. Additionally, partially condensed products of the above described silanes can be used. Further the following derivatives obtained by modifying these compounds can be used as silane coupling agents: amino-modified silylpolymer, silylated aminopolymer, unsaturated aminosilane complex, phenylamino-long chain alkylsilane, aminosilylated silicone and silylated polyester. Additionally, there can be used the reaction products of the above described silane coupling agents such as reaction products of the above described amino silanes and epoxy silanes, reaction products of the above described amino silanes and isocyanate silanes and partially condensed products of various silane coupling agents.

The above described silane coupling agent may be used alone or in a mixture of two or more kinds thereof.

In the present invention, the used amount of the component (D) is preferably of the order of 0.1 to 20 parts by weight, and more preferably of the order of 0.5 to 10 parts by weight, especially preferably of the order of 2 to 7 parts by weight with respect to 100 parts by weight of the component (A). When the blended amount of the component (D) is less than the above described ranges, sometimes sufficient adhesion cannot be obtained. On the other hand, when the blended amount of the component (D) exceeds the above described ranges, sometimes the practical curing rate cannot be obtained, and the curing reaction hardly proceeds to a sufficient extent.

In addition to the component (D) of the present invention, for example, epoxy resins, phenolic resins, sulfur, alkyl titanates, aromatic polyisocyanates and the like can be used as an adhesion-imparting agent. The adhesion-imparting agent is not limited particularly to them. The above described adhesion-imparting agents may be used alone or in a mixture of two or more thereof.

In the present invention, as the curing catalyst, the titanium chelate of the component (B) is used, and other curing catalysts can be simultaneously used to an extent not to degrade the effect of the present invention. Examples of the curing catalyst include metal salts of carboxylic acids such as tin 2-ethylhexanoate, tin versatate and bismuth 2-ethylhexanoate; tetravalent organotin compounds such as dibutyltin dilaurate, dibutyltin maleate, dibutyltin phthalate, dibutyltin dioctanoate, dibutyltin bis(2-ethylhexanoate), dibutyltin bis(methylmaleate), dibutyltin bis(ethylmaleate), dibutyltin bis(butylmaleate), dibutyltin bis(octylmaleate), dibutyltin bis(tridecylmaleate), dibutyltin bis(benzylmaleate), dibutyltin diacetate, dioctyltin bis(ethylmaleate), dioctyltin bis(octylmaleate), dibutyltin dimethoxide, dibutyltin bis(nonylphenoxide), dibutyltin oxide, dibutenyltin oxide, dibutyltin bis(acetylacetonate), dibutyltin bis(ethylacetoacetate), a reaction product of dibutyltin oxide and a silicate compound, and a reaction product of dibutyltin oxide and a phthalic acid ester; organoaluminum compounds such as aluminum tris(acetylacetonate), aluminum tris(ethylacetoacetate) and diisopropoxyaluminumethylacetoacetate; and zirconium compounds such as zirconium tetrakis(acetylacetonate). However, depending on an adding amount of the organotin compound, there is a case where toxicity of the obtained curing composition becomes strong.

A filler can be added to the composition of the present invention. Examples of the fillers include reinforcing fillers such as fumed silica, precipitated silica, crystalline silica, fused silica, dolomite, anhydrous silicic acid, hydrous silicic acid and carbon black; fillers such as ground calcium carbonate, precipitated calcium carbonate, magnesium carbonate, diatomite, sintered clay, clay, talc, titanium oxide, bentonite, organic bentonite, ferric oxide, aluminum fine powder, flint powder, zinc oxide, active zinc white, shirasu balloon, glass microballoon, organic microballoons of phenolic resin and vinylidene chloride resin, and resin powders such as PVC powder and PMMA powder; and fibrous fillers such as asbestos, glass fiber and glass filament. When a filler is used, the used amount thereof is 1 to 250 parts by weight, and preferably 10 to 200 parts by weight with respect to 100 parts by weight of the polymer of the component (A).

As described in Japanese Patent Laid-Open No. 2001-181532, it is possible to homogeneously mix the above described filler with a dehydrating agent such as oxidized calcium, put the mixture in a bag made of an air-tight material to be sealed and then allow to stand for a proper period of time to dehydrate and dry previously. The use of this low molecular weight filler makes it possible to improve storage stability in the case of one-component type composition.

Additionally, when preparing a highly transparent composition, as described in Japanese Patent Laid-Open No. 11-302527, it is possible to use, as a filler, a polymer powder prepared by using a polymer such as methyl methacrylate as a starting material or a non-crystalline silica. Also as described in Japanese Patent Laid-Open No. 2000-38560, a highly transparent composition can be obtained by using, as a filler, a hydrophobic silica which is a fine powder of silicon dioxide having hydrophobic groups bonded to the surface thereof. The surface of a fine powder of silicon dioxide has generally silanol groups (—SiOH), but can be formed into a hydrophobic silica by reacting those silanol groups with halides of organosilicon or alcohols to produce —SiO— hydrophobic group. Specifically, the hydrophobic silica is obtained by reacting silanol groups being present in the surface of the fine powder of silicon dioxide with dimethylsiloxane, hexamethyldisilazane, dimethyldichlorosilane, trimethoxyoctylsilane, trimethylsilane or the like. A fine powder of silicon dioxide in which the surface thereof is formed by silanol groups (—SiOH) is called a hydrophilic fine powder of silica.

When it is desired to obtain a cured article high in strength by use of these fillers, preferable is a filler mainly selected from fumed silica, precipitated silica, crystalline silica, fused silica, dolomite, anhydrous silicic acid, hydrous silicic acid, carbon black, surface treated fine calcium carbonate, sintered clay, clay and active zinc white; a desirable effect is obtained when such a filler is used within a range from 1 to 200 parts by weight with respect to 100 parts by weight of the reactive silicone group-containing organic polymer (A). Additionally, when it is desired to obtain a cured article low in tensile strength and large in elongation at break, a desirable effect is obtained by use of a filler mainly selected from titanium oxide, calcium carbonate such as ground calcium carbonate and magnesium carbonate, talc, ferric oxide, zinc oxide and shirasu balloon within a range from 5 to 200 parts by weight with respect to 100 parts by weight of the reactive silicone group-containing organic polymer (A). It is to be noted that in general, the calcium carbonate exhibits, with increasing specific surface area value thereof, an increasing improvement effect of the tensile strength at break, elongation at break and adhesion of the cured article. Needless to say, these fillers may be used either each alone or in admixtures of two or more thereof. When calcium carbonate is used, it is desirable to use surface treated fine calcium carbonate in combination with calcium carbonate larger in particle size such as ground calcium carbonate. The particle size of surface treated fine calcium carbonate is preferably not more than 0.5 μm, and the surface treatment is preferably carried out by treating with a fatty acid or a fatty acid salt. The calcium carbonate larger in particle size is preferably not less than 1 μm in particle size, and can be used without being subjected to surface treatment.

For the purpose of improving the workability (cutting property, etc) of the composition and deglossing the surface of the cured article, organic balloons and inorganic balloons are preferably added. Such fillers can be subjected to surface treatment, and may be used each alone or can be used in admixtures of two or more thereof. For the purpose of improving the workability (cutting property, etc), the particle sizes of these balloons are preferably not more than 0.1 mm. For the purpose of deglossing the surface of the cured article, the particle sizes are preferably 5 to 300 μm.

On the grounds that the cured article of the composition of the present invention is satisfactory in chemical resistance and the like, the composition of present invention is suitably used for joints of housing exterior wall such as sizing boards, in particular, ceramic sizing boards, for an adhesive for exterior wall tiles, for an adhesive for exterior wall tiles remaining in the joints and for the like purposes; in this connection, it is desirable that the design of the exterior wall and the design of the sealant are in harmony with each other. Particularly, posh exterior walls have come to be used by virtue of sputter coating and mixing colored aggregates. When the composition of the present invention is blended with a scale-like or granulated material having a diameter of not less than 0.1 mm, preferably of the order of 0.1 to 5.0 mm, the cured article comes to be in harmony with such posh exterior walls, and is excellent in chemical resistance, so that the composition concerned comes to be an excellent composition in the sense that the exterior appearance of the cured article remains unchanged over a long period of time. Use of a granulated material provides a dispersed sand-like or sandstone-like surface with a rough texture, while use of a scale-like material provides an irregular surface based on the scale-like shape of the material.

The preferable diameter, blended amount and materials for the scale-like or granulated material are described in Japanese Patent Laid-Open No. 9-53063 as follows.

The diameter is not less than 0.1 mm, preferably of the order of 0.1 to 5.0 mm, and there is used a material having an appropriate size in conformity with the material quality and pattern of exterior wall. Materials having a diameter of the order of 0.2 mm to 5.0 mm and materials having a diameter of the order of 0.5 mm to 5.0 mm can also be used. In the case of a scale-like material, the thickness is set to be as thin as the order of 1/10 to ⅕ the diameter (the order of 0.01 to 1.00 mm). The scale-like or granulated material is transported to the construction site as a sealant on condition that the material is beforehand mixed in the main component of the sealant, or is mixed in the main component of the sealant at the construction site when the sealant is used.

The scale-like or granulated material is blended in a content of the order of 1 to 200 parts by weight with respect to 100 parts by weight of a composition such as a sealant composition and an adhesive composition. The blended amount is appropriately selected depending on the size of the scale-like or granulated material, and the material quality and pattern of exterior wall.

As the scale-like or granulated material, natural products such as silica sand and mica, synthetic rubbers, synthetic resins and inorganic substances such as alumina are used. The material is colored in an appropriate color so as to match the material quality and pattern of exterior wall to heighten the design quality when filled in the joints.

A preferable finishing method and the like are described in Japanese Patent Laid-Open No. 9-53063.

Additionally, when a balloon (preferably the mean particle size thereof is not less than 0.1 mm) is used for a similar purpose, the surface is formed to have a dispersed sand-like or sandstone-like surface with a rough texture, and a reduction of weight can be achieved. The preferable diameter, blended amount and materials for the balloon are described in Japanese Patent Laid-Open No. 10-251618 as follows.

The balloon is a sphere-shaped material with a hollow interior. Examples of the material for such a balloon include inorganic materials such as glass, shirasu and silica; and organic materials such as phenolic resin, urea resin, polystyrene and Saran™; however, the material concerned is not limited to these examples; an inorganic material and an organic material can be compounded, or can be laminated to form multiple layers. An inorganic balloon, an organic balloon, a balloon made of a compounded inorganic-organic material or the like can be used. Additionally, as a balloon to be used, either a type of balloon or an admixture of multiple types of balloons can be used. Moreover, a balloon with the processed surface thereof or with the coated surface thereof can be used, and additionally, a balloon with the surface thereof subjected to treatment with various surface treatment agents can also be used. More specifically, examples are an organic balloon coated with calcium carbonate, talc, titanium oxide and the like, and an inorganic balloon subjected to surface treatment with a silane coupling agent.

For the purpose of obtaining a dispersed sand-like or sandstone-like surface with a rough texture, the particle size of the balloon is preferably not less than 0.1 mm. A balloon of a particle size of the order of 0.2 mm to 5.0 mm or a balloon of a particle size of the order of 0.5 mm to 5.0 mm can also be used. Use of a balloon of a particle size of less than 0.1 mm sometimes only increases the viscosity of the composition, and yields no rough texture, even when the used amount of the balloon is large. The blended amount of the balloon can be easily determined in conformity with the desired degree of the dispersed sand-like or sandstone-like rough texture. Usually, it is desirable that a balloon of not less than 0.1 mm in particle size is blended in a ratio of 5 to 25 vol % in terms of the volume concentration in the composition. When the volume concentration of the balloon is less than 5 vol %, no rough texture can be obtained, while when the volume concentration of the balloon exceeds 25 vol %, the viscosity of the sealant and that of the adhesive tend to become high to degrade the workability, and the modulus of the cured article becomes high, so that the basic performance of the sealant and that of the adhesive tend to be impaired. The preferable volume concentration to balance with the basic performance of the sealant is 8 to 22 vol %.

When a balloon is used, there can be added an antislip agent described in Japanese Patent Laid-Open No. 2000-154368 and an amine compound to make irregular and degloss the surface of the cured article as described in Japanese Patent Laid-Open No. 2001-164237, in particular, a primary amine and/or a secondary amine having a melting point of not less than 35° C.

Specific examples of the balloon are described in the following publications: Japanese Patent Laid-Open Nos. 2-129262, 4-8788, 4-173867, 5-1225, 7-113073, 9-53063, 10-251618, 2000-154368 and 2001-164237, and WO97/05201 pamphlet.

Additionally, thermally expandable fine hollow particles disclosed in Japanese Patent Laid-Open No. 2004-51701 or 2004-66749 can be used. The thermally expandable fine hollow particles are plastic spherical particulates produced by surrounding a low boiling point compound such as a hydrocarbon having 1 to 5 carbon atoms with a high molecular weight shell material (vinylidene chloride copolymer, acrylonitrile copolymer or vinylidene chloride-acrylonitrile copolymer). When the adhered portion obtained by using the composition of the present invention is heated, gas pressure inside the shell of the thermally expandable fine hollow particles is increased and the high molecular weight shell material is softened to markedly expand its volume and functions to cause peeling at the adhesion interface. By the addition of the thermally expandable fine hollow particles, it is possible to obtain an adhesive composition which can be peeled easily only by heating without breakage of material when adhesion becomes unnecessary and also can be peeled by heating without using an organic solvent.

When the composition of the present invention includes the particles of the cured article derived from a sealant, the cured article can make irregularities on the surface to improve the design quality. The preferable diameter, blended amount and materials of the cured article particle material derived from a sealant are described in Japanese Patent Laid-Open No. 2001-115142 as follows. The diameter is preferably of the order of 0.1 mm to 1 mm, and further preferably of the order of 0.2 to 0.5 mm. The blended amount is preferably 5 to 100 wt %, and further preferably 20 to 50 wt % in the curable composition. Examples of the materials include urethane resin, silicone, modified silicone and polysulfide rubber. No constraint is imposed on the materials as long as the materials can be used as sealants; however, modified silicone sealants are preferable.

To the composition of the present invention can be added an adhesion-imparting agent. No particular constraint is imposed on the adhesion-imparting resins, and usual adhesion-imparting resins can be used irrespective of solid form or liquid form at ordinary temperature. Specific examples of such adhesion-imparting resins include styrene block copolymers, hydrogenated products thereof, phenolic resins, modified phenolic resins (for example, cashew oil-modified phenolic resins, tall oil-modified phenolic resins and the like), terpene phenolic resins, xylene-phenol resins, cyclopentadiene-phenol resins, cumarone-indene resins, rosin resins, rosin ester resins, hydrogenated rosin ester resins, xylene resins, low molecular weight polystyrene resins, styrene copolymer resins, petroleum resins (for example, C5 hydrocarbon resin, C9 hydrocarbon resin, C5C9 hydrocarbon copolymer resin and the like), hydrogenated petroleum resins, terpene resins, DCPD resin-petroleum resin and the like. Those resins may be used either each alone or in combinations of two or more thereof. Examples of the styrene block copolymers and hydrogenated products thereof include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylenebutylene-styrene block copolymer (SEBS), styrene-ethylenepropylene-styrene block copolymer (SEPS), styrene-isobutylene-styrene block copolymer (SIBS) and the like. The above described adhesion-imparting resins may be used either each alone or in combinations of two or more thereof.

The adhesion-imparting resins are used within a range from 5 to 1,000 parts by weight, preferably from 10 to 100 parts by weight with respect to 100 parts by weight of the organic polymer (A).

To the composition of the present invention can be added a solvent or a diluent. No particular constraint is imposed on the solvent or the diluent, and aliphatic hydrocarbon, aromatic hydrocarbon, alicyclic hydrocarbon, halogenated hydrocarbon, alcohol, ester, ketone, ether and the like can be used. When a solvent or a diluent is used, the boiling point of the solvent is preferably not less than 150° C., more preferably not less than 200° C., particularly preferably not less than 250° C. from the viewpoint of a problem with contamination to the air when the composition is used indoor. These solvents or diluents may be used either each alone or in combinations of two or more thereof.

To the curable composition of the present invention, according to need, a physical properties-regulating agent for adjusting tensile properties of a produced cured article may be added. No particular constraint is imposed on the physical properties-regulating agent. Examples thereof include tetraalkoxysilanes (tetraalkylsilicates) such as tetramethoxysilane, tetraethoxysilane, ethoxytrimethoxysilane, dimethoxydiethoxysilane, methoxytriethoxysilane, tetra-n-propoxysilane, tetra-i-propoxysilane, tetra-n-butoxysilane, tetra-i-butoxysilane and tetra-t-butoxysilane; trialkoxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, butyltrimethoxysilane and phenyltrimethoxysilane; dialkoxysilanes such as dimethyldimethoxysilane, diethyldimethoxysilane and diphenyldimethoxysilane; monoalkoxysilanes such as trimethylmethoxysilane and triphenylmethoxysilane; alkylisopropenoxysilanes such as dimethyldiisopropenoxysilane and methyltriisopropenoxysilane; the partially hydrolyzed condensates of these silanes; silicone varnishes; polysiloxanes; and the like. By the use of the above described physical properties-regulating agent, when the composition of the present invention is cured, a hardness can be increased or reversely can be decreased and an elongation at break can be increased. The above described physical properties-regulating agent may be used alone or in a mixture of two or more kinds thereof. Additionally, by adding partially hydrolyzed condensates of tetraalkoxysilanes and alkoxysilanes, there can be obtained effects of enhancing water resistant adhesion of the curable composition and enhancing recovery properties of the obtained cured article.

Partially hydrolyzed condensates of organosilicate compounds are commercially available. Examples of such condensates include Methyl silicate 51 and Ethyl silicate 40 (both are products of Colcoat Co., Ltd.).

The used amount of the physical properties-regulating agent is preferably 0.1 to 20 parts by weight, and more preferably 0.5 to 10 parts by weight with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A).

To the curable composition of the present invention may be added, as case demands, a compound to hydrolytically produce a compound having a monovalent silanol group in the molecule thereof. This compound has an effect of decreasing the modulus of the cured article without degrading the stickiness of the surface of the cured article. Particularly, a compound to produce trimethylsilanol is preferable. Examples of the compound to hydrolytically produce a compound having a monovalent silanol group in the molecule thereof include a compound described in Japanese Patent Laid-Open No. 5-117521. Additionally, examples of such a compound include a compound which is a derivative of an alkyl alcohol such as hexanol, octanol or decanol, and produces a silicon compound to hydrolytically produce R³SiOH such as trimethylsilanol, and a compound described in Japanese Patent Laid-Open No. 11-241029 which is a derivative of a polyhydric alcohol having three or more hydroxy groups such as trimethylolpropane, glycerin, pentaerythritol or sorbitol, and produces a silicon compound to hydrolytically produce R³SiOH such as trimethylsilanol.

Additionally, there can be cited such a compound as described in Japanese Patent Laid-Open No. 7-258534 which is a derivative of oxypropylene polymer and produces a silicon compound to hydrolytically produce R³SiOH such as trimethylsilanol. Moreover, there can be used a polymer described in Japanese Patent Laid-Open No. 6-279693 which contains a hydrolyzable silicon-containing group capable of cross-linking and a silicon-containing group capable of hydrolytically forming a monosilanol-containing compound.

The compound to hydrolytically produce a compound having a monovalent silanol group in the molecule thereof is used within a range from 0.1 to 20 parts by weight, and preferably from 0.5 to 10 parts by weight, with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A).

To the curable composition of the present invention, according to need, a thixotropy providing agent (antisagging agent) may be added for the purpose of preventing sagging and improving workability. No particular constraint is imposed on the antisagging agent; however, examples of the antisagging agent include polyamide waxes; hydrogenated castor oil derivatives; and metal soaps such as calcium stearate, aluminum stearate and barium stearate. Additionally, when a rubber powder having a particle size of 10 to 500 μm as described in Japanese Patent Laid-Open No. 11-349916, and an organic fiber as described in Japanese Patent Laid-Open No. 2003-155389 are used, a composition having high thixotropy and satisfactory workability can be obtained. These thixotropy providing agents (antisagging agents) may be used either each alone or in combinations of two or more thereof. The thixotropy providing agents each are used within a range from 0.1 to 20 parts by weight with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A).

In the composition of the present invention, a compound containing an epoxy group in one molecule can be used. Use of an epoxy group-containing compound can increase the recovery properties of the cured article. Examples of the epoxy group-containing compound include compounds such as epoxidized unsaturated oils and fats, epoxidized unsaturated fatty acid esters, alicyclic epoxy compounds and epichlorohydrin derivatives, and admixtures of these compounds. More specific examples include epoxidized soybean oil, epoxidized flaxseed oil, bis(2-ethylhexyl)-4,5-epoxycyclohexane-1,2-dicarboxylate (E-PS), epoxyoctyl stearate and epoxybutyl stearate. Of these, E-PS is particularly preferable. It is recommended that these epoxy group-containing compounds each are used within a range from 0.5 to 50 parts by weight with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A).

For the composition of the present invention, a photocuring substance can be used. Use of a photocuring substance forms a coating film of the photocuring substance on the surface of the cured article to improve the stickiness and the weather resistance of the cured article. A photocuring substance means a substance which undergoes a chemical change, caused by action of light, of the molecular structure thereof in a fairly short time to result in changes of the physical properties such as curability. Among such a large number of compounds known are organic monomers, oligomers, resins and compositions containing these substances, and any commercially available substances concerned can optionally be adopted. As representative photocuring substances, unsaturated acryl compounds, polyvinyl cinnamates, azidized resins and the like can be used. The unsaturated acryl compounds are monomers, oligomers and admixtures of the monomers and the oligomers, the monomers and oligomers each having one or a few acryl or methacryl unsaturated groups; examples of the unsaturated acryl compounds include monomers such as propylene (or butylene, or ethylene)glycol di(meth)acrylate and neopentylglycol di(meth)acrylate, and oligoesters of not more than 10,000 in molecular weight related to these monomers. Specific examples include special acrylates (bifunctional) such as ARONIX M-210, ARONIX M-215, ARONIX M-220, ARONIX M-233, ARONIX M-240 and ARONIX M-245; special acrylates (trifunctional) such as ARONIX M-305, ARONIX M-309, ARONIX M-310, ARONIX M-315, ARONIX M-320 and ARONIX M-325; and special acrylates (multifunctional) such as ARONIX M-400. Those compounds which each have acrylic functional groups are particularly preferable, and additionally, those compounds which each have, on average, three or more acrylic functional groups in one molecule are preferable (all the aforementioned ARONIXs are the products of Toagosei Co., Ltd.).

Examples of the polyvinyl cinnamates include photosensitive resins having cinnamoyl groups as photosensitive groups, namely, those compounds obtained by esterification of polyvinyl alcohol with cinnamic acid; and additionally, a large number of derivatives of polyvinyl cinnamates. Azidized resins are known as photosensitive resins having azide groups as photosensitive groups; common examples of the azidized resins include a rubber photosensitive solution added with an azide compound as a photosensitive agent, and additionally, the compounds detailed in “photosensitive resins” (published by Insatu Gakkai Shuppanbu, Mar. 17, 1972, p. 93, p. 106 and p. 117); and these compounds can be used each alone or in admixtures thereof, and in combination with sensitizers to be added according to need. It is to be noted that addition of sensitizers such as ketones and nitro compounds and accelerators such as amines sometimes enhances the effect. It is recommended that the photocuring substance is used within a range from 0.1 to 20 parts by weight and preferably from 0.5 to 10 parts by weight with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A); when the content of the photocuring substance is less than 0.1 part by weight, no effect to increase the weather resistance is displayed, while when the content exceeds 20 parts by weight, the cured article tends to be too hard and cracked.

For the composition of the present invention, an oxygen-curable substance can be used. Examples of the oxygen-curable substance include unsaturated compounds reactable with the oxygen in the air, which react with the oxygen in the air and form a cured coating film around the surface of the cured article to act to prevent the surface stickiness and the sticking of dust and grime to the surface of the cured article and to do the like. Specific examples of the oxygen-curable substance include drying oils represented by wood oil, flaxseed oil and the like and various alkyd resins obtained by modifying these compounds; acryl polymers, epoxy resins and silicon resins all modified with drying oils; liquid polymers such as 1,2-polybutadiene and 1,4-polybutadiene obtained by polymerizing or copolymerizing diene compounds such as butadiene, chloroprene, isoprene and 1,3-pentadiene, and polymers derived from C5 to C8 dienes, liquid copolymers such as NBR, SBR and the like obtained by copolymerizing these diene compounds with monomers such as acrylonitrile, styrene and the like having copolymerizability so as for the diene compounds to dominate, and various modified substances of these compounds (maleinized modified substances, boiled oil-modified substances, and the like). These substances can be used either each alone or in combinations of two or more thereof. Of these substances, wood oil and liquid diene polymers are particularly preferable. Additionally, in some cases, when catalysts to accelerate the oxidation curing reaction and metal dryers are used in combination with these substances, the effect is enhanced. Examples of these catalysts and metal dryers include metal salts such as cobalt naphthenate, lead naphthenate, zirconium naphthenate, cobalt octylate and zirconium octylate; and amine compounds. It is recommended that the oxygen-curing substance is used within a range from 0.1 to 20 parts by weight and further preferably from 0.5 to 10 parts by weight with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A); when the used amount is less than 0.1 part by weight, improvement of stain-proof property becomes insufficient, while when the used amount exceeds 20 parts by weight, the tensile property and the like of the cured article tends to be impaired. It is recommended that the oxygen-curing substance is used in combination with a photocuring substance as described in Japanese Patent Laid-Open No. 3-160053.

For the composition of the present invention, an antioxidant (antiaging agent) can be used. Use of an antioxidant can increase the heat resistance of the cured article. Examples of the antioxidant can include hindered phenol antioxidants, monophenol antioxidants, bisphenol antioxidants and polyphenol antioxidants, and hindered phenol antioxidants are particularly preferable. Similarly, the following hindered amine photostabilizers can also be used: TINUVIN 622LD, TINUVIN 144; CHIMASSORB944LD and CHIMASSORB119FL (all produced by Ciba-Geigy Japan Ltd.); MARK LA-57, MARK LA-62, MARK LA-67, MARK LA-63 and MARK LA-68 (all produced by Adeka Corporation); and SANOL LS-770, SANOL LS-765, SANOL LS-292, SANOL LS-2626, SANOL LS-1114 and SANOL LS-744 (all produced by Sankyo Co., Ltd.). Specific examples of the antioxidants are described also in Japanese Patent Laid-Open Nos. 4-283259 and 9-194731. It is recommended that the antioxidant is used within a range from 0.1 to 10 parts by weight and further preferably from 0.2 to 5 parts by weight with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A).

For the composition of the present invention, a photostabilizer can be used. Use of a photostabilizer can prevent the photooxidation degradation of the cured article. Examples of the photostabilizer include benzotriazole compounds, hindered amine compounds, benzoate compounds and the like; hindered amine compounds are particularly preferable. It is recommended that the photostabilizer is used within a range from 0.1 to 10 parts by weight and further preferably from 0.2 to 5 parts by weight with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A). Specific examples of the photostabilizer are described in Japanese Patent Laid-Open No. 9-194731.

When the photocuring substance is used for the composition of the present invention, in particular, when an unsaturated acryl compound is used, it is preferable to use a tertiary amine-containing hindered amine photostabilizer as a hindered amine photostabilizer as described in Japanese Patent Laid-Open No. 5-70531 for the purpose of improving the storage stability of the composition. Examples of the tertiary amine-containing hindered amine photostabilizer include TINUVIN 622LD, TINUVIN 144 and CHIMASSORB119FL (all produced by Ciba-Geigy Japan Ltd.); MARK LA-57, LA-62, LA-67 and LA-63 (all produced by Adeka Corporation); and SANOL LS-765, SANOL LS-292, SANOL LS-2626, SANOL LS-1114 and SANOL LS-744 (all produced by Sankyo Co., Ltd.).

For the composition of the present invention, an ultraviolet absorber can be used. Use of an ultraviolet absorber can increase the surface weather resistance of the cured article. Examples of the ultraviolet absorber include benzophenone compounds, benzotriazole compounds, salicylate compounds, substituted tolyl compounds and metal chelate compounds; benzotriazole compounds are particularly preferable. The ultraviolet absorber is used within a range from 0.1 to 10 parts by weight, and further preferably from 0.2 to 5 parts by weight with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A). It is preferable that a phenol antioxidant, a hindered phenol antioxidant, a hindered amine photostabilizer and a benzotriazole ultraviolet absorber are used in combination.

To the composition of the present invention, an epoxy resin can be added. The composition added with an epoxy resin is particularly preferable as an adhesive, in particular, an adhesive for exterior wall tile. Examples of the epoxy resin include epichlorohydrin-bisphenol A-type epoxy resins, epichlorohydrin-bisphenol F-type epoxy resins, flame resistant epoxy resins such as glycidyl ether of tetrabromobisphenol A, novolac-type epoxy resins, hydrogenated bisphenol A-type epoxy resins, epoxy resins of the type of glycidyl ether of bisphenol A propyleneoxide adduct, p-oxybenzoic acid glycidyl ether ester-type epoxy resins, m-aminophenol epoxy resins, diaminodiphenylmethane epoxy resins, urethane modified epoxy resins, various alicyclic epoxy resins, N,N-diglycidylaniline, N,N-diglycidyl-o-toluidine, triglycidyl isocyanurate, polyalkylene glycol diglycidyl ether, glycidyl ethers of polyhydric alcohols such as glycerin, hydantoin-type epoxy resins and epoxidized substances of unsaturated polymers such as petroleum resins; however the epoxy resin is not limited to these examples, and commonly used epoxy resins can be used. Epoxy resins having at least two epoxy groups in one molecule are preferable because such compositions are high in reactivity when curing is made, and the cured articles can easily form three dimensional networks. Examples of further preferable epoxy resins include bisphenol A-type epoxy resins or novolac-type epoxy resins. The ratio of the used amount of each of these epoxy resins to the used amount of the reactive silicon group-containing organic polymer (A) falls, in terms of weight ratio, in the range such that organic polymer (A)/epoxy resin=100/1 to 1/100. When the ratio of organic polymer (A)/epoxy resin is less than 1/100, the effect of improving the impact strength and the toughness of the cured article of the epoxy resin becomes hardly obtainable, while when the ratio of organic polymer (A)/epoxy resin exceeds 100/1, the strength of the cured article of the organic based polymer becomes insufficient. The preferable ratio of the used amounts varies depending on the application of the curable resin composition and hence cannot be unconditionally determined; for example, when the impact resistance, flexibility, toughness, peel strength and the like of the cured article of the epoxy resin are to be improved, it is recommended that with respect to 100 parts by weight of the epoxy resin, 1 to 100 parts by weight of the component (A), further preferably 5 to 100 parts by weight of the component (A) is used. On the other hand, when the strength of the cured article of the component (A) is to be improved, it is recommended that with respect to 100 parts of the component (A), 1 to 200 parts by weight of the epoxy resin, further preferably 5 to 100 parts by weight of the epoxy resin is used.

When the epoxy resin is added, as a matter of course, a curing agent to cure the epoxy resin can be applied together to the composition of the present invention. No particular constraint is imposed on the usable epoxy resin-curing agent, and commonly used epoxy resin-curing agents can be used. Specific examples of the epoxy resin-curing agent include primary and secondary amines such as triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, N-aminoethylpiperidine, m-xylylenediamine, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, isophoronediamine, and polyether with amine terminal groups; tertiary amines such as 2,4,6-tris(dimethylaminomethyl)phenol and tripropylamine, and salts of those tertiary amines; polyamide resins; imidazoles; dicyandiamides; borontrifluoride complexes; carboxylic anhydrides such as phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, dodecynylsuccinic anhydride, pyromellitic anhydride and chlorendic anhydride; alcohols; phenols; carboxylic acids; and diketone complexes of aluminum and zirconium. However, the epoxy resin-curing agent is not limited to these examples. Additionally, the curing agents may be used either each alone or in combinations of two or more thereof.

When an epoxy resin-curing agent is used, the used amount thereof falls within a range from 0.1 to 300 parts by weight with respect to 100 parts by weight of the epoxy resin.

As an epoxy resin-curing agent, a ketimine can be used. A ketimine is stable when no moisture is present, but moisture decomposes the ketimine into a primary amine and a ketone; the thus produced primary amine acts as a room temperature curable curing agent to cure the epoxy resin. Use of a ketimine makes it possible to obtain a one-component type composition. Such a ketimine can be obtained by condensation reaction of an amine compound and a carbonyl compound.

For the synthesis of a ketimine, an amine compound and a carbonyl compound well known in the art can be used. For example, the following compounds can be used as such an amine compound: diamines such as ethylenediamine, propylenediamine, trimethylenediamine, tetramethylenediamine, 1,3-diaminobutane, 2,3-diaminobutane, pentamethylenediamine, 2,4-diaminopentane, hexamethylenediamine, p-phenylenediamine and p,p′-biphenylenediamine; polyvalent amines such as 1,2,3-triaminopropane, triaminobenzene, tris(2-amionoethyl)amine and tetrakis(aminomethyl)methane; polyalkylenepolyamines such as diethylenetriamine, triethylenetriamine and tetraethylenepentamine; polyoxyalkylene polyamines; and aminosilanes such as γ-aminopropyltriethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane and N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane. Additionally, the following compounds can be used as such a carbonyl compound: aldehydes such as acetaldehyde, propionaldehyde, n-butylaldehyde, isobutylaldehyde, diethylacetaldehyde, glyoxal and benzaldehyde; cyclic ketones such as cyclopentanone, trimethylcyclopentanone, cyclohexanone and trimethylcyclohexanone; aliphatic ketones such as acetone, methyl ethyl ketone, methyl propyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, diethyl ketone, dipropyl ketone, diisopropyl ketone, dibutyl ketone and diisobutyl ketone; and β-dicarbonyl compounds such as acetylacetone, methyl acetoacetate, ethyl acetoacetate, dimethyl malonate, diethyl malonate, methyl ethyl malonate and dibenzoylmethane.

When an imino group is present in the ketimine, the imino group can be reacted with styrene oxide; glycidyl ethers such as butyl glycidyl ether and allyl glycidyl ether; and glycidyl esters. These ketimines may be used either each alone or in combinations of two or more thereof; these ketimines each are used within a range from 1 to 100 parts by weight with respect to 100 parts by weight of the epoxy resin, the used amount of each of the ketimines varies depending on the type of the epoxy resin and the type of the ketimine.

To the curable composition of the present invention can be added a phosphorous-based plasticizer such as polyphosphoric acid ammonium or tricresyl phosphate and a flame retardant such as aluminum hydroxide, magnesium hydroxide or thermally expandable graphite. These flame retardants may be used either each alone or in combinations of two or more thereof.

The flame retardant is used within a range from 5 to 200 parts by mass, and preferably from 10 to 100 parts by mass with respect to 100 parts by weight of the component (A).

To the curable composition of the present invention, various additives can be added according to need for the purpose of regulating the physical properties of the curable composition or the cured article. Examples of such additives include curing regulators, radical inhibitors, metal deactivators, antiozonants, phosphorus-based peroxide decomposers, lubricants, pigments, foaming agents, ant-proofing agents and mildewproofing agents. These various additives may be used either each alone or in combinations of two or more thereof. Specific examples of additives other than the specific examples cited in the present specification are described, for example, in Japanese Patent Examined Publication Nos. 4-69659 and 7-108928, Japanese Patent Laid-Open Nos. 63-254149, 64-22904, 2001-72854 and the like.

The curable composition of the present invention can also be prepared as a one-component type composition curable after application with moisture in the air in such a way that all the blended components are beforehand blended together and hermetically stored. The curable composition of the present invention can also be prepared as two-component type composition in such a way that a compound agent is prepared as a curing agent by blending together a curing catalyst, a filler, a plasticizer and water, and the thus blended material is mixed with a polymer composition before use. From the viewpoint of workability, a one-component type composition is preferable.

When the above described curable composition is of the one-component type, all the blended components are blended together beforehand, so that it is preferable that the blended components containing moisture are used after dehydrating and drying, or the components are dehydrated by reducing pressure or the like while being kneaded for blending. When the above described curable composition is of the two-component type, it is not necessary to blend a curing catalyst with the main component containing a reactive silicon group-containing polymer, and hence there is little fear of gelation even when some moisture is contained in the blended components; however, when a long term storage stability is required, it is preferable to carry out dehydration and drying. As for the methods of dehydration and drying, a thermal drying method is suitable for a powdery solid substance or the like, while a reduced pressure dehydration method or a dehydration method which uses a synthetic zeolite, active alumina, silica gel, quick lime or magnesium oxide is suitable for a liquid substance. Additionally, there can be adopted a method in which a small amount of an isocyanate compound is added to make its isocyanate group react with water for dehydration, or a method in which an oxazolidine compound such as 3-ethyl-2-methyl-2-(3-methylbutyl)-1,3-oxazolidine is added to make it react with water for dehydration. In addition to these dehydration and drying methods, addition of the following compounds further improves the storage stability: lower alcohols such as methanol and ethanol; and alkoxysilane compounds such as n-propyltrimethoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane, methylsilicate, ethylsilicate, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane and γ-glycidoxypropyltrimethoxysilane.

It is particularly preferable that the used amount of a dehydrating agent, in particular, a silicon compound capable of reacting with water such as vinyltrimethoxysilane falls within a range from 0.1 to 20 parts by weight, and preferably 0.5 to 10 parts by weight with respect to 100 parts by weight of the reactive silicon group-containing organic polymer (A).

No particular constraint is imposed on the preparation method of the curable composition of the present invention; for example, there can be adopted a common method in which the above described components are blended together and kneaded with a mixer, a roll or a kneader at room temperature or under heating, or a common method in which the above described components are dissolved and mixed by use of a small amount of an appropriate solvent.

The curable composition of the present invention forms three dimensional networks when exposed to the air due to the action of the moisture to be cured into a solid matter having a rubber-like elasticity.

The curable composition of the present invention can be used as tackifiers, sealants for buildings, ships, vehicles and road, adhesives, mold forming materials, vibration-proof material, damping materials, soundproof materials, foaming materials, coating materials, spraying materials and the like. It is preferable that the cured article obtained by curing the curable composition of the present invention is used as a sealant and an adhesive because the cured article is excellent in flexibility and adhesion.

Additionally, the curable composition of the present invention can be used in various applications as liquid sealants to be used in materials for electric and electronic components such as backside sealants for solar cells, electric insulating materials such as insulating coating materials for use in electric wire and cable, elastic adhesives, contact type adhesives, spray type sealants, crack repairing materials, adhesives for tiling, powdery coating materials, casting materials, medical rubber materials, medical adhesives, medical instrument sealants, food packaging materials, sealants for joints in exterior materials such as sizing boards, coating materials, primers, electromagnetic wave shielding conductive materials, heat conducting materials, hot melt materials, electric and electronic potting agents, films, gaskets, various molding materials, antirust and waterproof sealants for edges (cut portions) of wire glass and laminated glass, vehicle components, electric appliance components, various machinery components and the like. Moreover, the curable composition of the present invention can adhere alone or in combination with a primer to a wide variety of substrates including glass, porcelain, woods, metals and molded resin articles, and accordingly, can be used as various types of sealing and adhesive compositions. Additionally, the curable composition of the present invention can be used as adhesives for interior panels, adhesive for exterior panels, adhesives for tiling, adhesives for stone tiling, adhesives for finishing ceiling, adhesives for finishing floor, adhesives for finishing wall, adhesives for vehicle panels, adhesives for assembling electric, electronic and precision instruments, sealants for direct glazing, sealants for double glazing, sealants for the SSG technique and sealants for working joints of buildings.

EXAMPLES

In the next place, the present invention is specifically described on the basis of examples and comparative examples, but the present invention is not limited by these examples and comparative examples.

Synthesis Example 1

By use of a polyoxypropylene diol having a molecular weight of about 2,000 as an initiator and zinc hexacyanocobaltate-glyme complex as a catalyst, polymerization of propylene oxide was carried out to yield a hydroxy group-terminated polypropylene oxide having a number average molecular weight of about 25,500 (a molecular weight relative to polystyrene standard measured by using a HLC-8120 GPC manufactured by Tosoh Corp. as a liquid delivery system, a column of TSK-GEL H-type manufactured by Tosoh Corp., and THF as a solvent) (This is referred to as polymer Q). Then, a methanol solution of NaOMe was added in an amount of 1.2 equivalents with respect to the hydroxy group of the above hydroxy group-terminated polypropylene oxide, the methanol was distilled off, and allyl chloride was further added to thereby convert the terminal hydroxy group into an allyl group. The unreacted allyl chloride was distilled off under reduced pressure. To 100 parts by weight of the obtained crude allyl-terminated polypropylene oxide, 300 parts by weight of n-hexane and 300 parts by weight of water were added. The mixture thus obtained was stirred to mix, and then the water was removed by centrifugal separation. To the hexane solution thus obtained, 300 parts by weight of water was further added, the mixture thus obtained was stirred to mix, the water was again removed by centrifugal separation, and then the hexane was distilled off under reduced pressure. Thus, an allyl group-terminated bifunctional polypropylene oxide having a number average molecular weight of about 25,500 was obtained.

100 Parts by weight of the obtained allyl group-terminated polypropylene oxide and 0.9 part by weight of methyldimethoxysilane were reacted at 90° C. for five hours by using, as a catalyst, 150 ppm of isopropanol solution of platinum-vinylsiloxane complex containing 3 wt % platinum to yield a polyoxypropylene polymer (A-1) terminated with methyldimethoxysilyl group. By measurement using ¹H-NMR (measured in CDCl₃ as a solvent by use of a JNM-LA400 manufactured by JEOL Ltd.), a silylation ratio was calculated and the number of terminal methyldimethoxysilyl groups per molecule was 1.3 on average.

Synthesis Example 2

100 Parts by weight of the polymer Q obtained in Synthesis Example 1 and 1.8 parts by weight of γ-isocyanatepropyltrimethoxysilane were reacted at 90° C. for five hours to yield a polyoxypropylene polymer (A-2) terminated with trimethoxysilyl group. By measurement using ¹H-NMR, a silylation ratio was calculated and the number of terminal trimethoxysilyl groups per molecule was 1.4 on average.

Synthesis Example 3

An allyl group-terminated polypropylene oxide was obtained in the same manner as in Synthesis Example 1 by using a hydroxy group-terminated polypropylene oxide having a number average molecular weight of about 19,000 and obtained by polymerizing propylene oxide by use of a 1/1 (weight ratio) mixture of a polyoxypropylene diol having a molecular weight of about 2,000 and a polyoxypropylene triol having a molecular weight of about 3,000 as an initiator and zinc hexacyanocobaltate-glyme complex as a catalyst. This allyl group-terminated polypropylene oxide was reacted with 1.35 parts by weight of methyldimethoxysilane in the same manner as in Synthesis Example 1 to yield a polyoxypropylene polymer (A-3) having 1.7 terminal methyldimethoxysilyl groups on average.

Synthesis Example 4

To a polyoxypropylene glycol having a molecular weight of about 3,000 was added a methanol solution of NaOMe in an amount of 1.2 equivalents with respect to the hydroxy group of the polyoxypropylene diol, the methanol was distilled off, and allyl chloride was further added to thereby convert the terminal hydroxy group into an allyl group. Refining was carried out in the same manner as in Synthesis Example 1 to yield a bifunctional polypropylene oxide (C-1) having a number average molecular weight of about 3,000 in which 97% of the terminal is allyl groups.

Examples 1 and 2 and Comparative Examples 1 and 2

The reactive silicon group-containing polyoxyalkylene polymer (A-1) obtained in Synthesis Example 1 as the component (A), a filler, a titanium oxide, a plasticizer (component (C)), an antisagging agent, an ultraviolet absorber, a photostabilizer, an antioxidant, a dehydrating agent, an adhesion-imparting agent and the component (B) as a curing catalyst were weighed out according to the formulations shown in Table 1, then, these ingredients were mixed together with a mixer to yield each one-component type curable composition, and each composition was charged in an aluminum cartridge.

The curable compositions each were extruded from the cartridge and filled in a molding frame of about 5 mm in thickness with a spatula; the surface of each of the filled compositions was fully flattened; and the planarization completion time was set as the curing starting time. The surface of each of the compositions was touched with a spatula every one minute during the first one hour, and every 15 minutes thereafter, and the skin formation time was measured as the time when the composition no longer stuck to the spatula.

The one-component type curable compositions each were extruded from the cartridge so that the compositions each were adhered to an article to be adhered (glass, steel sheet, stainless steel sheet, hard polyvinyl chloride), and were aged at 23° C. for 7 days. Thereafter, the compositions were subjected to a 90 degree hand peel test. The breakdown conditions of the cured articles were observed and the cohesion failure rates (CF rate) were investigated.

The evaluation and aging were carried out under the condition of air-conditioning at 23° C. at 50% RH. The results obtained are shown in Table 1. In the table, A denotes the CF rates of 100%, B denotes the CF rates of not less than 50% and less than 100%, C denotes the CF rates of not less than 10% and less than 50%, and D denotes the CF rate of less than 10%.

TABLE 1 Comparative Example Example Composition (parts by weight) 1 2 1 2 Organic polymer (A) A-1 100 100 100 100 Filler Hakuenka CCR ⁽¹⁾ Shiraishi Kogyo Kaisha, Ltd. 120 120 120 120 Titanium oxide Tipaque R-820 Ishihara Sangyo Kaisha, Ltd. 20 20 20 20 High molecular Actocol P23 ⁽²⁾ Takeda Pharmaceutical Co., Ltd. 55 weight plasticizer (C) C-1 55 Plasticizer DIDP ⁽³⁾ Kyowa Hakko Kogyo Co., Ltd. 55 MESAMOLL II ⁽⁴⁾ Bayer 55 Antisagging agent Disparlon #6500 ⁽⁵⁾ Kusumoto Chemicals, Ltd. 2 2 2 2 Ultraviolet absorber Sumisorb 400 ⁽⁶⁾ Sumitomo Chemical Co., Ltd. 1 1 1 1 Photo stabilizer Sanol LS-765 ⁽⁷⁾ Sankyo Co., Ltd. 1 1 1 1 Antioxidant Irganox 1010 ⁽⁸⁾ Ciba-Geigy Japan Ltd. 1 1 1 1 Dehydrating agent A-171 ⁽⁹⁾ Nippon Unicar Company Limited 2 2 2 2 Adhesion-imparting A-1120 ⁽¹⁰⁾ Nippon Unicar Company Limited 3 3 3 3 agent Titanium chelate (B) Orgatix TC-750 ⁽¹¹⁾ Matsumoto Chemical Industry Co., 7.5 7.5 7.5 7.5 Ltd. Curability Skin formation time (hour) 3 2.5 2.5 3.5 Adhesion 90 Degree hand peel Glass A A A A Steel sheet B A D C Stainless steel sheet B B D D Hard polyvinyl chloride B A D D ⁽¹⁾ Colloidal calcium carbonate ⁽²⁾ PPG3000 ⁽³⁾ Diisodecyl phthalate ⁽⁴⁾ Alkylsulfonic acid phenyl ester ⁽⁵⁾ Fatty acid amide wax ⁽⁶⁾ 2,4-di-t-butylphenyl-3,5-di-t-butyl-4-hydroxybenzoate ⁽⁷⁾ Bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate ⁽⁸⁾ Pentaerythrityl-tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] ⁽⁹⁾ Trimethoxyvinylsilane ⁽¹⁰⁾ H₂NC₂H₄NHC₃H₆Si(OMe)₃ ⁽¹¹⁾ Diisopropoxytitaniumbis(ethylacetoacetate)

As shown in Table 1, in the curable composition prepared using the reactive silicon group-containing polyoxyalkylene polymer (A) and a titanium chelate as a catalyst, when a low molecular weight plasticizer such as DIDP or MESAMOLL was used as a plasticizer like Comparative Example 1, interfacial separation occurred in several substrates in evaluation of adhesion by 90 degree hand peel. On the contrary, in the cases where the high molecular weight plasticizer was used like Examples, it became obvious that in any of substrates, a satisfactory CF rate was exhibited and adhesion was improved. Particularly when the allyl group-terminated polyether (C-1) prepared in Synthesis Example 3 was used as a plasticizer, an adhesion improvement effect was high and practical curability was maintained.

On the other hand, when titanium tetraisopropoxide was used as a titanium catalyst other than the titanium chelate (C), a skin formation time was very long, and the composition was not cured even one day after.

Example 3 and Comparative Example 3

One-component type curable compositions were prepared in the same manner as above according to the formulations shown in Table 2 by using the polymer (A-2) obtained in Synthesis Example 2 as the component (A).

The curable compositions each were extruded from the cartridge and filled in a molding frame of about 5 mm in thickness with a spatula; the surface of each of the filled compositions was fully flattened, and the planarization completion time was set as the curing starting time. The surface of each of the compositions was touched every five minutes with a finger wiped with ethanol, and the tack-free time was measured as the time when the composition no longer stuck to the finger.

Additionally, adhesion (glass, hard polyvinyl chloride, FRP) was evaluated in the same manner as above. The results are shown in Table 2.

TABLE 2 Comparative Example Example Composition (parts by weight) 3 3 Organic polymer (A) A-1 100 100 Filler Hakuenka CCR ⁽¹⁾ Shiraishi Kogyo Kaisha, Ltd. 120 120 Titanium oxide Tipaque R-820 Ishihara Sangyo Kaisha, Ltd. 20 20 High molecular C-1 55 weight plasticizer (C) Plasticizer DIDP ⁽²⁾ Kyowa Hakko Kogyo Co., Ltd. 55 Antisagging agent Disparlon #6500 ⁽³⁾ Kusumoto Chemicals, Ltd. 2 2 Ultraviolet absorber Sumisorb 400 ⁽⁴⁾ Sumitomo Chemical Co., Ltd. 1 1 Photostabilizer Sanol LS-765 ⁽⁵⁾ Sankyo Co., Ltd. 1 1 Antioxidant Irganox 1010 ⁽⁶⁾ Ciba-Geigy Japan Ltd. 1 1 Dehydrating agent A-171 ⁽⁷⁾ Nippon Unicar Company Limited 2 2 Adhesion-imparting A-1120 ⁽⁸⁾ Nippon Unicar Company Limited 3 3 agent Titanium chelate (B) Orgatix TC-750 ⁽⁹⁾ Matsumoto Chemical Industry Co., 4 4 Ltd. Curability Tack-free time (min) 50 60 Adhesion 90 Degree hand peel Glass A A Hard polyvinyl chloride A D FRP A D ⁽¹⁾ Colloidal calcium carbonate ⁽²⁾ Diisodecyl phthalate ⁽³⁾ Fatty acid amide wax ⁽⁴⁾ 2,4-di-t-butylphenyl-3,5-di-t-butyl-4-hydroxybenzoate ⁽⁵⁾ Bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate ⁽⁶⁾ Pentaerythrityl-tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] ⁽⁷⁾ Trimethoxyvinylsilane ⁽⁸⁾ H₂NC₂H₄NHC₃H₆Si(OMe)₃ ⁽⁹⁾ Diisopropoxytitaniumbis(ethylacetoacetate)

As shown in Table 2, the composition prepared using the high molecular weight plasticizer (C-1) as a plasticizer showed satisfactory adhesion to several substrates to be adhered as compared with the composition prepared using phthalic acid ester.

Reference Examples 1 and 2

Table 3 shows the results of evaluation of an effect on adhesion depending on a kind of a plasticizer by using an organotin compound (Neostann U-220) as a catalyst.

TABLE 3 Reference Example Composition (parts by weight) 1 2 Organic polymer (A) A-3 100 100 Filler Hakuenka CCR ⁽¹⁾ Shiraishi Kogyo Kaisha, Ltd. 120 120 Titanium oxide Tipaque R-820 Ishihara Sangyo Kaisha, Ltd. 20 20 High molecular Actocol P23 ⁽²⁾ Takeda Pharmaceutical Co., Ltd. 55 weight plasticizer (C) Plasticizer DIDP ⁽³⁾ Kyowa Hakko Kogyo Co., Ltd. 55 Antisagging agent Disparlon #6500 ⁽⁴⁾ Kusumoto Chemicals, Ltd. 2 2 Ultraviolet absorber Tinuvin 327 ⁽⁵⁾ Ciba-Geigy Japan Ltd. 1 1 Photostabilizer Sanol LS-770 ⁽⁶⁾ Sankyo Co., Ltd. 1 1 Dehydrating agent A-171 ⁽⁷⁾ Nippon Unicar Company Limited 2 2 Adhesion-imparting A-1120 ⁽⁸⁾ Nippon Unicar Company Limited 3 3 agent Organotin compound Neostann U-220 ⁽⁹⁾ Nitto Kasei Kaisha, Ltd. 2 2 Adhesion 90 Degree hand peel Glass A A Steel sheet D D Stainless steel sheet B B Polyvinyl chloride coated steel sheet A B Hard polyvinyl chloride A B ⁽¹⁾ Colloidal calcium carbonate ⁽²⁾ PPG3000 ⁽³⁾ Diisodecyl phthalate ⁽⁴⁾ Fatty acid amide wax ⁽⁶⁾ 2-(3,5-di-t-butyl-2-hydroxyphenyl)-5-chlorobenzotriazole ⁽⁶⁾ Bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate ⁽⁷⁾ Trimethoxyvinylsilane ⁽¹⁰⁾ H₂NC₂H₄NHC₃H₆Si(OMe)₃ ⁽¹¹⁾ Dibutyltin(IV)bisacetylacetonate, metal (Sn) content: 27.5%

As it is clear from Table 3, when the organotin compound was used as a catalyst, there was no enhancement of adhesion even by the use of the high molecular weight plasticizer PPG3000 as a plasticizer as compared with the use of DIDP.

Reference Examples 3 to 5

Table 4 shows the results of evaluation of an effect on adhesion depending on a kind of a plasticizer by using a divalent tin carboxylate salt as a catalyst.

TABLE 4 Reference Example Composition (parts by weight) 3 4 5 Organic polymer (A) A-3 100 100 100 Filler Hakuenka CCR ⁽¹⁾ Shiraishi Kogyo Kaisha, Ltd. 120 120 120 Titanium oxide Tipaque R-820 Ishihara Sangyo Kaisha, Ltd. 20 20 20 Plasticizer DIDP ⁽²⁾ Kyowa Hakko Kogyo Co., Ltd. 30 High molecular Actocol P23 ⁽³⁾ Takeda Pharmaceutical Co., Ltd. 30 weight plasticizer (C) C-1 30 Antisagging agent Disparlon #6500 ⁽⁴⁾ Kusumoto Chemicals, Ltd. 2 2 2 Ultraviolet absorber Tinuvin 327 ⁽⁵⁾ Ciba-Geigy Japan Ltd. 1 1 1 Photostabilizer Sanol LS-770 ⁽⁶⁾ Sankyo Co., Ltd. 1 1 1 Dehydrating agent A-171 ⁽⁷⁾ Nippon Unicar Company Limited 2 2 2 Adhesion-imparting A-1120 ⁽⁸⁾ Nippon Unicar Company Limited 5 5 5 agent Crosslinking agent Methyl silicate 51 ⁽⁹⁾ Colcoat Co., Ltd. 2 2 2 Curing catalyst Neostann U-50 ⁽¹⁰⁾ Nitto Kasei Kaisha Ltd. 3.4 3.4 3.4 Versatic 10 ⁽¹¹⁾ Japan Epoxy Resins Co., Ltd. 0.5 0.5 0.5 DEAPA ⁽¹²⁾ Wako Pure Chemicals Co., Ltd. 0.5 0.5 0.5 Adhesion 90 Degree hand peel Glass A B A Steel sheet C C D Stainless steel sheet A B A Polyvinyl chloride-coated steel sheet B B B Hard polyvinyl chloride B B C ⁽¹⁾ Colloidal calcium carbonate ⁽²⁾ Diisodecyl phthalate ⁽³⁾ PPG3000 ⁽⁴⁾ Fatty acid amide wax ⁽⁵⁾ 2-(3,5-di-t-butyl-2-hydroxyphenyl)-5-chlorobenzotriazole ⁽⁶⁾ Bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate ⁽⁷⁾ Trimethoxyvinylsilane ⁽⁸⁾ H₂NC₂H₄NHC₃H₆Si(OMe)₃ ⁽⁹⁾ Condensation product of tetramethoxysilane (Si content: 51%) ⁽¹⁰⁾ Tin neodecanoate (II), metal (Sn) content: 22 to 24% ⁽¹¹⁾ Neodecanoic acid ⁽¹²⁾ 3-Diethylaminopropylamine

As it is clear from Table 4, when a tin salt of dicarboxylic acid was used as a catalyst, there was no enhancement of adhesion even by the use of the high molecular weight plasticizers (C-1) and PPG3000 as a plasticizer as compared with the use of DIDP.

From the above described results, in the curable composition comprising the reactive silicone group-containing organic polymer, it is obvious that an effect of improving adhesion by use of a high molecular weight plasticizer is exhibited specifically in the case of using the titanium chelate of the component (C) as a catalyst. 

1. A curable composition comprising, as components, (A) an organic polymer having a silicon-containing group which is capable of crosslinking by forming siloxane bonds, (B) a titanium chelate represented by the following general formula (1) or (2) and (C) a high molecular weight plasticizer having a number average molecular weight of 1,000 to 15,000. General formula (1):

wherein each of n R¹s is independently a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, each of (4-n) R²s is independently hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, each of (4-n) A¹s and (4-n) A²s is independently —R³ or —OR³ where R³ is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, n is 1, 2 or
 3. General formula (2):

wherein R², A¹ and A² are the same as defined above, R⁴ is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms.
 2. The curable composition according to claim 1, wherein a main chain skeleton of said organic polymer of the component (A) is at least one kind of polymer selected from the group consisting of polyoxyalkylene polymers, saturated hydrocarbon polymers and (meth)acrylate polymers.
 3. The curable composition according to claim 2, wherein said polyoxyalkylene polymers are polyoxypropylene polymers.
 4. The curable composition according to claim 1, wherein said component (C) is a high molecular weight plasticizer having a polyoxyalkylene structure in its main chain.
 5. The curable composition according to claim 4, wherein said component (C) is a high molecular weight polyoxyalkylene plasticizer having no hydroxyl group.
 6. The curable composition according to claim 1, wherein the composition further contains a silane coupling agent as the component (D).
 7. A sealant comprising said curable composition according to claim
 1. 8. An adhesive comprising said curable composition according to claim
 1. 9. The curable composition according to claim 2, wherein said component (C) is a high molecular weight plasticizer having a polyoxyalkylene structure in its main chain.
 10. The curable composition according to claim 3, wherein said component (C) is a high molecular weight plasticizer having a polyoxyalkylene structure in its main chain.
 11. The curable composition according to claim 2, wherein the composition further contains a silane coupling agent as the component (D).
 12. The curable composition according to claim 3, wherein the composition further contains a silane coupling agent as the component (D).
 13. The curable composition according to claim 4, wherein the composition further contains a silane coupling agent as the component (D).
 14. The curable composition according to claim 5, wherein the composition further contains a silane coupling agent as the component (D).
 15. A sealant comprising said curable composition according to claim
 2. 16. A sealant comprising said curable composition according to claim
 3. 17. A sealant comprising said curable composition according to claim
 4. 18. A sealant comprising said curable composition according to claim
 5. 19. A sealant comprising said curable composition according to claim
 6. 20. An adhesive comprising said curable composition according to claim
 2. 